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AD6655ABCPZRL7-125

Analog Devices

AD6655ABCPZRL7-125 by Analog Devices

AD6655ABCPZRL7-125 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and max current of 0.705mA. This BASEBAND CIRCUIT IC comes in a square chip carrier package with matte tin finish, suitable for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,427 parts In-Stock

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5,427

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Digiode

USA . 304 parts In-Stock

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304

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Distributors (Availability)

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Native Components

USA . 276 parts In-Stock

1+ parts

$0.344

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$0.330

276

$0.344

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$0.330

Northwest PG Solutions

USA . 2,213 parts In-Stock

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$0.378

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$0.334

2,213

$0.378

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$0.334

Parana Technologies

USA . 731 parts In-Stock

1+ parts

$6.465

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$6.013

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731

$6.465

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$6.013

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IDEA Electronic Components Group

UK . 875 parts In-Stock

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$6.952

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$6.604

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875

$6.952

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$6.604

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AZTECH Wire

Italy . 348 parts In-Stock

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$7.503

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348

$7.503

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DigiPath Technology Company

USA . 2,086 parts In-Stock

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$10.845

100+ parts

$10.411

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$10.411

2,086

$10.845

$10.411

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$10.411

One Stop Electronics

USA . 1,093 parts In-Stock

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$91.000

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1,093

$91.000

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Semicontronic

India . 815 parts In-Stock

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$470.000

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$458.250

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$455.900

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815

$470.000

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$455.900

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Ampacity Inc.

Singapore . 821 parts In-Stock

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$982.000

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821

$982.000

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Corphita

USA . 395 parts In-Stock

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Overview

Experience top-notch performance and reliability with the AD6655ABCPZRL7-125 by Analog Devices, a leading manufacturer in the industry. This cellphone IC boasts surface mount capabilities, a square package shape, and a wide temperature range for industrial applications. With a low supply current and high-quality construction, this product offers exceptional value and benefits to customers seeking cutting-edge technology for their telecommunications needs. Trust in Analog Devices to deliver superior products that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, providing convenience and cost-effectiveness.

Package Shape: SQUARE

The square package shape of this product enables a more compact design, optimizing space utilization in electronic devices.

Power Supplies (V): 1.8

Operating at a low power supply voltage of 1.8V helps improve energy efficiency and prolong battery life in mobile devices.

No. of Terminals: 64

Having 64 terminals allows for a high level of connectivity and functionality in the product, making it suitable for advanced cellphone applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and a very thin profile package style provides efficient heat dissipation and compact size for enhanced performance in cellphone applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product ensures reliable performance even under demanding conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

Being able to operate at temperatures as low as -40 °C ensures that the product can withstand extreme environmental conditions, enhancing its durability and reliability.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring a reliable electrical connection in the product.

Terminal Position: QUAD

The quad terminal position provides enhanced stability and secure connection within the circuit, contributing to the overall performance and reliability of the product.

Maximum Seated Height: 1 mm

The low seated height of 1mm enables a slim and compact design for the product, making it suitable for thin and lightweight cellphone applications.

Width: 9 mm

The 9mm width of the product contributes to a compact form factor, allowing for easy integration into small electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand a peak reflow temperature for up to 30 seconds ensures proper soldering and assembly of the product onto the circuit board, guaranteeing reliable performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can undergo high-temperature reflow soldering processes, ensuring secure and durable connections in cellphone applications.

Length: 9 mm

The 9mm length of the product complements its compact width and height, allowing for a space-efficient design in electronic devices.

Temperature Grade: INDUSTRIAL

Being classified as an industrial-grade temperature component, this product is suitable for use in harsh environments and industrial applications where reliability is crucial.

Terminal Form: NO LEAD

The no lead terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices, making the product a sustainable choice.

Maximum Supply Current: 0.705 mA

Operating at a maximum supply current of 0.705 mA ensures efficient power consumption and extends the battery life of the cellphone device.

Telecom IC Type: BASEBAND CIRCUIT

Being classified as a baseband circuit telecom IC type, this product is designed specifically for handling communication processing tasks in cellphone devices, ensuring optimal performance.

Nominal Supply Voltage: 1.8 V

Having a nominal supply voltage of 1.8V ensures compatibility with standard voltage requirements in cellphone applications, enabling easy integration into existing designs.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density packaging of the product, enabling more terminals to be packed into a smaller space, ideal for compact cellphone designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is designed to withstand moderate exposure to moisture during handling and assembly processes, ensuring long-term reliability in cellphone applications.

Technical Specifications

Cellphone ICs AD6655ABCPZRL7-125 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.705 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

AD6655ABCPZRL7-125 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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