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CC1021RSST

Texas Instruments

CC1021RSST by Texas Instruments

The Texas Instruments CC1021RSST is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a data rate of 0.1536 Mbps, making it ideal for telecommunications applications.

Median Price

$9.140

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,250 parts In-Stock

1+ parts

$9.140

100+ parts

$7.984

1k+ parts

$5.506

10k+ parts

-

1,250

$9.140

$7.984

$5.506

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,647 parts In-Stock

1+ parts

$8.683

100+ parts

-

1k+ parts

-

10k+ parts

-

1,647

$8.683

-

-

-

Vyrian

USA . 7,161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,161

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 272 parts In-Stock

1+ parts

$0.527

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$0.527

-

-

-

Northwest PG Solutions

USA . 376 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

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376

$0.580

-

-

-

Corphita

USA . 4,602 parts In-Stock

1+ parts

$8.226

100+ parts

-

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-

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4,602

$8.226

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-

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Corohmni

South Africa . 211 parts In-Stock

1+ parts

$8.810

100+ parts

-

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211

$8.810

-

-

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AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$15.140

100+ parts

-

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226

$15.140

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Parana Technologies

USA . 53 parts In-Stock

1+ parts

$15.611

100+ parts

-

1k+ parts

$15.982

10k+ parts

-

53

$15.611

-

$15.982

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DigiPath Technology Company

USA . 1,277 parts In-Stock

1+ parts

$17.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,277

$17.190

-

-

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ChromeModa Solutions

Germany . 4,606 parts In-Stock

1+ parts

$17.541

100+ parts

$14.384

1k+ parts

-

10k+ parts

-

4,606

$17.541

$14.384

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IDEA Electronic Components Group

UK . 204 parts In-Stock

1+ parts

$17.541

100+ parts

$16.664

1k+ parts

$15.787

10k+ parts

-

204

$17.541

$16.664

$15.787

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$18.453

100+ parts

$16.792

1k+ parts

$15.131

10k+ parts

-

3,000

$18.453

$16.792

$15.131

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Robosynatics

Brazil . 900 parts In-Stock

1+ parts

-

100+ parts

$13.960

1k+ parts

$12.927

10k+ parts

$12.927

900

-

$13.960

$12.927

$12.927

Lucentia Tech

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$13.960

1k+ parts

$12.927

10k+ parts

$12.927

900

-

$13.960

$12.927

$12.927

Overview

Elevate your cellphone's performance with the CC1021RSST by Texas Instruments. Crafted with precision and expertise, this RF and baseband circuit IC offers unparalleled quality and reliability. Whether you're looking to enhance your smartphone or streamline your telecommunications system, this product delivers exceptional value and benefits. Trust in Texas Instruments to power your devices with cutting-edge technology. Experience the difference with the CC1021RSST today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easier to handle and less prone to damage.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for compact electronic devices.

No. of Terminals: 32

Having 32 terminals allows for more connectivity options and functionality within the device.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in various environmental conditions.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is common in many electronic devices, making this product compatible with a wide range of applications.

Technical Specifications

Cellphone ICs CC1021RSST attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Data Rate:

.1536 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC1021RSST Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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