Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CC1000/T&R by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch and gull wing terminal form.
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Plastic and epoxy material provides durability and protection for the internal components of the cellphone ICs.
Surface mount technology allows for easy and efficient assembly of the ICs onto circuit boards, saving time and space.
Having multiple power supply options allows flexibility in designing and using the ICs in various applications.
A higher number of terminals provide more connectivity options and functionalities for the ICs.
The small outline and thin profile of the package make it space-efficient and suitable for compact devices like cellphones.
With a high maximum operating temperature, the ICs can perform reliably even in harsh environmental conditions.
The low minimum operating temperature ensures the ICs can function in colder climates without any issues.
Dual terminal position allows for more secure connections and better conductivity for the ICs.
Low seated height makes the ICs suitable for slim and compact devices like cellphones.
The narrow width of the ICs enables them to be used in tight spaces and small electronics.
The compact length of the ICs adds to their suitability for smaller devices like cellphones.
Industrial-grade temperature tolerance ensures the ICs can withstand demanding industrial environments.
CMOS technology offers low power consumption and high speed performance for the ICs.
Gull wing terminal form ensures secure soldering connections for the ICs during assembly.
The RF and baseband circuit type makes the ICs suitable for telecom applications, ensuring reliable communication.
The 3V nominal supply voltage is common in many electronic devices, making the ICs compatible with a wide range of systems.
The small terminal pitch allows for fine-pitch mounting and high-density packaging of the ICs on circuit boards.
Cellphone ICs CC1000/T&R attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
CC1000/T&R Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
1N4148WT
Onsemi
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Silicon Standard
Daco Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
ADC31RF80IRMP
Texas Instruments' ADC31RF80IRMP is a cellphone IC with 72 terminals in a square chip carrier package. Operating from -40 to 85°C, it features RF and baseband circuits, 1.15V supply voltage, and 1439mA max current draw. Ideal for telecom applications due to its compact size and industrial temperature grade suitability.
TOBY-L210-65S
U-blox Ag
TOBY-L210-65S by U-blox Ag is a surface mount Cellphone IC with 1 function. It has 152 terminals and a rectangular package shape. With a max operating temperature of 65°C, it is suitable for RF and baseband circuit applications.
RFFM6903TR13
Rf Micro Devices
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 28; Package Code: HLGA; Package Shape: SQUARE;
ADRF5545ABCPZN-R7
Analog Devices
Analog Devices' ADRF5545ABCPZN-R7 is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
SARA-R422-00B
RF AND BASEBAND CIRCUIT;
LMH2121TMX/NOPB
LMH2121TMX/NOPB by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates b/w -40 to 85°C and has a max supply current of 4.7mA. This RF and baseband circuit is suitable for telecom applications due to its low power consumption and compact design.
TLV320AC57IPT
TLV320AC57IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage, operating from -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a low-profile flatpack with gull wing terminals, suitable for industrial temperature grades.
AD6636CBCZ
AD6636CBCZ by Analog Devices is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 1.8V, making it ideal for cellphone applications.
ADF4360-3BCPZ
ADF4360-3BCPZ by Analog Devices is a cellphone IC with a square package shape and 24 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.3 V. This IC is commonly used in baseband circuit applications.
MAX2676EWT+
MAX2676EWT+ by Analog Devices is a CELLPHONE IC with BICMOS tech. It operates at -40 to 85 °C, has 3.3V supply, and RF/BASEBAND circuits. The package is GRID ARRAY, 0.69mm height, and 1.27mm length for telecom applications.
CC1150-RTR1
CC1150-RTR1 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it suitable for industrial telecom applications.
CC1050-RTR1
CC1050-RTR1 by Texas Instruments is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V and terminal pitch of 0.65mm.
CC2400-STR1
CC2400-STR1 by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include CMOS technology, RF and baseband circuit for telecom applications, and nominal voltage of 1.8V.
CC1110EMK868-915
SARA-R500S-00B
CC1150RST
CC1150RST by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.
HMC830LP6GE
Analog Devices' HMC830LP6GE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits, with a nominal voltage of 3.3V. Its compact size of 6x6mm and very thin profile make it suitable for telecom applications requiring high performance in limited space.
HMC381LP6ETR
Analog Devices' HMC381LP6ETR is a cellphone IC with 28 terminals in a square chip carrier package. It operates b/w -40 °C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
ADRF5547BCPZN-R7
Analog Devices' ADRF5547BCPZN-R7 is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. This RF front end circuit has a nominal voltage of 5V and terminal pitch of 0.5mm, making it ideal for telecom applications.
HMC818LP4ETR
Analog Devices' HMC818LP4ETR is a 24-terminal cellphone IC in a square chip carrier package with very thin profile. It operates b/w -40 °C to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at 3V supply voltage.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC1000PW
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
CC1000PWR
CC1000PWRG3
CC1000PWRG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with gull wing terminals suitable for industrial applications.
CC1020RSSR
The Texas Instruments CC1020RSSR is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature range of -40 to 85°C, CMOS technology, and RF & baseband circuit type make it ideal for industrial telecom applications. With a nominal voltage of 3V and data rate of 0.1536 Mbps, it offers high performance in a compact form factor.
CC1000-RWP2
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR;
CC1020RSST
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CC1020-RTR1
CC1020RUZ
CC1000_UCSP/T&R
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 28; Package Code: BGA; Package Shape: RECTANGULAR;
CC1000YZ
CC1000-RTB1
CC1000YZR
CC1000-RTR2
CC1020-RTB1
CC1020RSS
CC1000
CC1000PWG3
CC1000-RTR1
CC1020RSSG4
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