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CC2510F32RHHT

Texas Instruments

CC2510F32RHHT by Texas Instruments

CC2510F32RHHT by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features CMOS, surface mount capability, and a terminal pitch of 0.5mm for industrial applications.

Median Price

$7.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,250 parts In-Stock

1+ parts

$4.821

100+ parts

$3.930

1k+ parts

$2.620

10k+ parts

-

10,250

$4.821

$3.930

$2.620

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$7.800

100+ parts

$5.180

1k+ parts

$4.710

10k+ parts

-

250

$7.800

$5.180

$4.710

-

DigiKey

USA . 187 parts In-Stock

1+ parts

$7.800

100+ parts

$5.910

1k+ parts

$5.133

10k+ parts

$5.059

187

$7.800

$5.910

$5.133

$5.059

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,385 parts In-Stock

1+ parts

$4.580

100+ parts

-

1k+ parts

-

10k+ parts

-

4,385

$4.580

-

-

-

Vyrian

USA . 2,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 166 parts In-Stock

1+ parts

$0.247

100+ parts

-

1k+ parts

-

10k+ parts

$0.237

166

$0.247

-

-

$0.237

Northwest PG Solutions

USA . 1,039 parts In-Stock

1+ parts

$0.272

100+ parts

-

1k+ parts

-

10k+ parts

$0.240

1,039

$0.272

-

-

$0.240

Corphita

USA . 386 parts In-Stock

1+ parts

$4.339

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$4.339

-

-

-

Parana Technologies

USA . 983 parts In-Stock

1+ parts

$13.662

100+ parts

-

1k+ parts

$14.163

10k+ parts

-

983

$13.662

-

$14.163

-

DigiPath Technology Company

USA . 1,800 parts In-Stock

1+ parts

$15.044

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

$15.044

-

-

-

ChromeModa Solutions

Germany . 2,261 parts In-Stock

1+ parts

$15.351

100+ parts

$12.588

1k+ parts

-

10k+ parts

-

2,261

$15.351

$12.588

-

-

IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$15.351

100+ parts

$14.583

1k+ parts

$13.816

10k+ parts

-

179

$15.351

$14.583

$13.816

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Perfect Parts

USA . 1,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

-

-

-

-

Overview

Elevate your cellphone performance with the CC2510F32RHHT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that are designed for optimal performance and reliability. This advanced technology offers customers the advantage of seamless connectivity and enhanced functionality in their devices. Upgrade your cellphone experience with the CC2510F32RHHT and enjoy the benefits of cutting-edge innovation in the palm of your hand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and convenient assembly onto circuit boards, saving space and enabling efficient manufacturing processes.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the circuit board, allowing for compact and sleek designs.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in compatibility with various systems and applications.

No. of Terminals: 36

Having 36 terminals allows for connectivity with a wide range of external components and peripherals, enhancing the versatility of the IC.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance (-40 to 85°C) ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient performance and reduced heat generation.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC has a moderate sensitivity to moisture, so appropriate handling and storage precautions need to be taken to maintain its reliability.

Technical Specifications

Cellphone ICs CC2510F32RHHT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

CC2510F32RHHT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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