Loading...

TLV320AC56N

Texas Instruments

TLV320AC56N by Texas Instruments

TLV320AC56N by Texas Instruments is a Cellphone IC with 20 terminals in RECTANGULAR package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL use. This BASEBAND CIRCUIT has nominal voltage of 3 V and terminal pitch of 2.54 mm, ideal for cellphone applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,231

-

-

-

-

Digiode

USA . 1,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,139

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 507 parts In-Stock

1+ parts

$14.999

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$14.999

-

-

-

Parana Technologies

USA . 294 parts In-Stock

1+ parts

$15.328

100+ parts

-

1k+ parts

$15.723

10k+ parts

-

294

$15.328

-

$15.723

-

ChromeModa Solutions

Germany . 5,861 parts In-Stock

1+ parts

$17.223

100+ parts

$14.123

1k+ parts

-

10k+ parts

-

5,861

$17.223

$14.123

-

-

IDEA Electronic Components Group

UK . 2,103 parts In-Stock

1+ parts

$17.223

100+ parts

$16.362

1k+ parts

$15.501

10k+ parts

-

2,103

$17.223

$16.362

$15.501

-

Ampacity Inc.

Singapore . 788 parts In-Stock

1+ parts

$105.000

100+ parts

-

1k+ parts

-

10k+ parts

-

788

$105.000

-

-

-

One Stop Electronics

USA . 1,523 parts In-Stock

1+ parts

$434.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,523

$434.000

-

-

-

Semicontronic

India . 994 parts In-Stock

1+ parts

$499.000

100+ parts

$486.525

1k+ parts

$484.030

10k+ parts

-

994

$499.000

$486.525

$484.030

-

DigiPath Technology Company

USA . 1,559 parts In-Stock

1+ parts

-

100+ parts

$15.528

1k+ parts

-

10k+ parts

-

1,559

-

$15.528

-

-

Corphita

USA . 1,255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,255

-

-

-

-

Corohmni

South Africa . 431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

431

-

-

-

-

Overview

Upgrade your cellphone's audio quality with the TLV320AC56N from Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance with this baseband circuit IC. Perfect for improving sound in mobile devices, this rectangular-shaped IC offers industrial-grade reliability and a nominal supply voltage of 3V. Enhance your cellphone experience with crystal-clear audio and trust in Texas Instruments for superior technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this IC lightweight and durable, suitable for various applications.

No. of Terminals: 20

With 20 terminals, this IC can support complex circuit connections and functionalities, making it versatile for different cellphone designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environments, increasing the overall durability of the cellphone IC.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to function effectively in cold conditions, making it suitable for a wide range of use cases.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit type, this IC is essential for processing and managing communication signals in cellphones, ensuring smooth voice and data transmissions.

Technical Specifications

Cellphone ICs TLV320AC56N attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TLV320AC56N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20