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TRF6903PTG4

Texas Instruments

TRF6903PTG4 by Texas Instruments

TRF6903PTG4 by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 2.5/3.3V. This RF and baseband circuit has a low profile flatpack style for industrial telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,528 parts In-Stock

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5,528

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Digiode

USA . 1,181 parts In-Stock

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1,181

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Distributors (Availability)

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Parana Technologies

USA . 617 parts In-Stock

1+ parts

$8.476

100+ parts

$787.159

1k+ parts

$7.629

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617

$8.476

$787.159

$7.629

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DigiPath Technology Company

USA . 897 parts In-Stock

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$9.334

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897

$9.334

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ChromeModa Solutions

Germany . 1,362 parts In-Stock

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$9.524

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$7.810

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1,362

$9.524

$7.810

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IDEA Electronic Components Group

UK . 649 parts In-Stock

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$9.524

100+ parts

$9.048

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$8.572

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649

$9.524

$9.048

$8.572

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AZTECH Wire

Italy . 706 parts In-Stock

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$14.865

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706

$14.865

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Component Stockers USA

USA . 694 parts In-Stock

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$99.990

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694

$99.990

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One Stop Electronics

USA . 550 parts In-Stock

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$508.000

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550

$508.000

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Kepictronics

USA . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,046 parts In-Stock

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Corphita

USA . 4,825 parts In-Stock

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Overview

Experience seamless connectivity and superior performance with the TRF6903PTG4 by Texas Instruments, a leading manufacturer known for its high-quality cellphone ICs. This cutting-edge product offers reliability and efficiency, making it ideal for various applications in the telecom industry. With advanced features and innovative design, this component ensures optimal functionality and enhances user experience. Upgrade your devices with the TRF6903PTG4 and enjoy the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for portable devices like cellphones.

Surface Mount: YES

Surface mounting allows for easy and automated assembly processes, increasing efficiency and reducing production costs.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for compatibility with different cellphone models and configurations.

No. of Terminals: 48

Having a higher number of terminals enables more connectivity options and functionalities within the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand demanding usage conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures reliable and low-resistance connections, enhancing overall performance and longevity.

Width: 7 mm

The compact width of 7 mm allows for space-efficient design and integration into small form factor cellphones.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range means the IC can operate reliably in harsh environmental conditions, increasing its versatility and durability.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7 V is a common standard in cellphone electronics, ensuring compatibility with existing power systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and more compact PCB designs, critical for modern smartphone designs.

Technical Specifications

Cellphone ICs TRF6903PTG4 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF6903PTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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