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MAX2051ETP+

Analog Devices

MAX2051ETP+ by Analog Devices

MAX2051ETP+ by Analog Devices is a Cellphone IC with 20 terminals in a square package. It operates at -40 to 85 °C, with a supply voltage of 5V and current draw of 0.13mA. This RF and baseband circuit uses BICMOS technology for industrial telecom applications.

Median Price

$42.280

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

MAX2051ETP+ by Analog Devices
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 832 parts In-Stock

1+ parts

$36.070

100+ parts

-

1k+ parts

$24.740

10k+ parts

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832

$36.070

-

$24.740

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DigiKey

USA . 35 parts In-Stock

1+ parts

$48.490

100+ parts

$35.979

1k+ parts

$34.953

10k+ parts

-

35

$48.490

$35.979

$34.953

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Mouser Electronics

USA . 24 parts In-Stock

1+ parts

$49.460

100+ parts

$36.700

1k+ parts

$35.650

10k+ parts

-

24

$49.460

$36.700

$35.650

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Verical

USA . 60 parts In-Stock

1+ parts

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100+ parts

$26.481

1k+ parts

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10k+ parts

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60

-

$26.481

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 942 parts In-Stock

1+ parts

$25.622

100+ parts

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942

$25.622

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-

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Vyrian

USA . 5,870 parts In-Stock

1+ parts

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5,870

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Anansix

USA . 1,155 parts In-Stock

1+ parts

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1,155

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ComSIT Distribution GmbH

Germany . 114 parts In-Stock

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114

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Semtec, LLC

USA . 5 parts In-Stock

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5

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-

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 14,723 parts In-Stock

1+ parts

$5.986

100+ parts

-

1k+ parts

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14,723

$5.986

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Texas Native Microelectronics

USA . 100 parts In-Stock

1+ parts

$6.880

100+ parts

$6.605

1k+ parts

$6.398

10k+ parts

$6.054

100

$6.880

$6.605

$6.398

$6.054

Kenton Components

USA . 25,840 parts In-Stock

1+ parts

$8.256

100+ parts

-

1k+ parts

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10k+ parts

$7.265

25,840

$8.256

-

-

$7.265

Qasali Group International

UK . 2,930 parts In-Stock

1+ parts

$18.576

100+ parts

-

1k+ parts

$17.276

10k+ parts

$16.347

2,930

$18.576

-

$17.276

$16.347

CoreStaff

Japan . 5 parts In-Stock

1+ parts

$23.121

100+ parts

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5

$23.121

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-

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Corphita

USA . 207 parts In-Stock

1+ parts

$24.273

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207

$24.273

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Component Stockers USA

USA . 342 parts In-Stock

1+ parts

$24.910

100+ parts

$28.210

1k+ parts

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342

$24.910

$28.210

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Semicontronic

India . 87 parts In-Stock

1+ parts

$26.370

100+ parts

$25.711

1k+ parts

$25.579

10k+ parts

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87

$26.370

$25.711

$25.579

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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100+ parts

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7,000

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Perfect Parts

USA . 233 parts In-Stock

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233

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Overview

Experience the cutting-edge technology of the MAX2051ETP+ by Analog Devices, a leading manufacturer in the industry. This advanced Cellphone IC boasts superior quality and reliability, making it the perfect solution for a wide range of applications. With its surface mount design and compact package shape, this IC offers ease of installation and space-saving benefits. Elevate your projects with the MAX2051ETP+ and unlock unparalleled performance and efficiency. Trust Analog Devices to deliver top-notch products that exceed expectations and drive innovation in the telecommunications sector.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a circuit board, making it convenient and efficient for assembly.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, making it suitable for compact electronic devices.

Power Supplies (V): 5

Operating at 5 volts makes this product compatible with standard power sources, ensuring easy integration into various electronic systems.

No. of Terminals: 20

Having 20 terminals provides multiple connection points, allowing for versatility in functionality and integration with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal performance and space efficiency in electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in extreme cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and improved solderability, ensuring long-term reliability in various environmental conditions.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm allows for a low-profile design, suitable for compact electronic devices with space constraints.

Width: 5 mm

The width of 5 mm provides a balance between compact size and functional capability, making it a versatile choice for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures efficient soldering and assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables the product to undergo reflow soldering without damage, ensuring reliable connections.

Length: 5 mm

The length of 5 mm complements the compact square shape, allowing for efficient placement on a circuit board.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product can withstand harsh environmental conditions and maintain reliable performance.

Technology: BICMOS

Being a Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS) technology ensures a balance between power efficiency and speed, suitable for various telecommunications applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and ensures compliance with RoHS regulations for environmentally friendly electronics.

Maximum Supply Current: 0.13 mA

Operating with a low supply current of 0.13 mA minimizes power consumption, making it energy-efficient for battery-operated devices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit capabilities in a single IC enhances communication performance and simplifies design in telecommunication applications.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5 volts ensures compatibility with standard power sources, simplifying integration into electronic systems.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise connections on a compact scale, enabling high-density circuit design and functionality.

Technical Specifications

Cellphone ICs MAX2051ETP+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2051ETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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