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HMC485MS8GE

Analog Devices

HMC485MS8GE by Analog Devices

Analog Devices' HMC485MS8GE is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,971 parts In-Stock

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7,971

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North Shore Components

USA . 1,026 parts In-Stock

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1,026

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Digiode

USA . 392 parts In-Stock

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392

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Connector Distribution Corp

USA . 115 parts In-Stock

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115

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Right Parts Inc.

USA . 115 parts In-Stock

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115

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Distributors (Availability)

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Parana Technologies

USA . 3,762 parts In-Stock

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$7.056

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$6.562

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3,762

$7.056

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$6.562

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IDEA Electronic Components Group

UK . 991 parts In-Stock

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$7.587

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$7.208

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991

$7.587

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$7.208

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AZTECH Wire

Italy . 368 parts In-Stock

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$11.386

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368

$11.386

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DigiPath Technology Company

USA . 2,104 parts In-Stock

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$11.836

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$11.362

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$11.362

2,104

$11.836

$11.362

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$11.362

Semicontronic

India . 158 parts In-Stock

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$346.000

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$337.350

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$335.620

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158

$346.000

$337.350

$335.620

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One Stop Electronics

USA . 1,216 parts In-Stock

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$939.000

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1,216

$939.000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,104 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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RC Electronics

USA . 2,198 parts In-Stock

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$4.250

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$3.850

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$3.720

2,198

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$4.250

$3.850

$3.720

Assy Fe

Spain . 1,000 parts In-Stock

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Metaverse IC Inc.

Canada . 651 parts In-Stock

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651

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Perfect Parts

USA . 532 parts In-Stock

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532

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Kepictronics

USA . 220 parts In-Stock

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220

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Corphita

USA . 151 parts In-Stock

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Futuretech Components

Singapore . 131 parts In-Stock

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Overview

Upgrade your cellphone technology with the HMC485MS8GE by Analog Devices. Manufactured with top-quality materials and cutting-edge design, this RF and baseband circuit offers unmatched performance and reliability. Ideal for a wide range of applications, this compact and versatile IC enhances signal processing and connectivity in smartphones, ensuring seamless communication and superior user experience. Trust Analog Devices to deliver innovation that exceeds expectations. Elevate your mobile device capabilities with the HMC485MS8GE today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product ideal for use in various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape provides a compact and uniform design, making it easy to integrate into electronic devices with limited space.

No. of Terminals: 8

Having a moderate number of terminals allows for flexibility in connecting the IC to other components while keeping the design simple and streamlined.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and maintain optimal performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, increasing versatility and usability.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance and reliability.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options, enhancing compatibility and ease of integration in various circuit designs.

Maximum Seated Height: 1.1 mm

The low seated height helps in minimizing the overall profile of the product, making it suitable for compact electronic devices.

Width: 3 mm

The narrow width of the IC enhances space efficiency and enables easier placement on circuit boards with limited real estate.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the IC can withstand the soldering process and ensure secure attachment to the PCB during assembly.

Length: 3 mm

The compact length of the IC contributes to a smaller footprint, allowing for efficient use of space in electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand demanding operating conditions and deliver reliable performance in rugged environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and facilitates easy inspection and maintenance of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry in one IC offers improved integration and performance in telecommunications applications, reducing complexity and cost.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage, this IC can be easily integrated into a wide range of electronic systems without requiring additional power components.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on PCBs, allowing for more components to be placed within a limited area and enhancing overall functionality.

Technical Specifications

Cellphone ICs HMC485MS8GE attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

HMC485MS8GE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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