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HMC495LP3

Analog Devices

HMC495LP3 by Analog Devices

Analog Devices' HMC495LP3 is a cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits in telecom applications. With a nominal voltage of 3.3V, this surface-mount IC has a compact size of 3x3mm and terminal pitch of 0.5mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,223 parts In-Stock

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Digiode

USA . 848 parts In-Stock

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848

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Distributors (Availability)

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AZTECH Wire

Italy . 667 parts In-Stock

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$7.443

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667

$7.443

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Parana Technologies

USA . 548 parts In-Stock

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$16.616

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$15.453

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548

$16.616

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$15.453

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IDEA Electronic Components Group

UK . 160 parts In-Stock

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$17.867

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$16.974

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$16.974

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160

$17.867

$16.974

$16.974

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DigiPath Technology Company

USA . 1,457 parts In-Stock

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$27.873

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$26.758

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$26.758

1,457

$27.873

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$26.758

One Stop Electronics

USA . 434 parts In-Stock

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$383.000

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434

$383.000

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Semicontronic

India . 678 parts In-Stock

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$819.000

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$798.525

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$794.430

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678

$819.000

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Corphita

USA . 274 parts In-Stock

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Perfect Parts

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Overview

Enhance the performance of your cellphone with the HMC495LP3 by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge technology in the form of this Cellphone IC. With a package body made of durable PLASTIC/EPOXY material and a compact SQUARE shape, this IC is perfect for various applications in the telecom industry. Experience seamless connectivity and superior functionality with the HMC495LP3, designed to operate efficiently in industrial settings with a wide temperature range. Elevate your mobile experience and stay connected with ease using this innovative product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and reliability, making this product a suitable choice for long term use.

Surface Mount: YES

Surface mount technology enables easy and efficient soldering, making it convenient for assembly processes.

Package Shape: SQUARE

Square shape allows for easy placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for different functions and features within the IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the IC can function effectively in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the IC can operate in cold conditions without performance degradation.

Terminal Finish: TIN LEAD

Tin lead finish provides good electrical conductivity and solderability, ensuring a reliable connection within the assembly.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common and standard voltage level, making it compatible with a wide range of electronic devices.

Technical Specifications

Cellphone ICs HMC495LP3 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3 mm

Trade Compliance

HMC495LP3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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