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HMC422MS8ETR

Analog Devices

HMC422MS8ETR by Analog Devices

HMC422MS8ETR by Analog Devices is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C and has a nominal voltage of 3V. This RF and baseband circuit is designed for telecom applications requiring high performance in a compact form factor.

Median Price

$3.710

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 710,000 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

$1.330

10k+ parts

$0.890

710,000

$3.710

-

$1.330

$0.890

Verical

USA . 710,000 parts In-Stock

1+ parts

-

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-

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710,000

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-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 157 parts In-Stock

1+ parts

$2.071

100+ parts

-

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157

$2.071

-

-

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Vyrian

USA . 412 parts In-Stock

1+ parts

$3.710

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412

$3.710

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-

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Prism Electronics

USA . 370 parts In-Stock

1+ parts

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370

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ACDS - Activité Composants Distribution Service

France . 316 parts In-Stock

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316

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 709,864 parts In-Stock

1+ parts

$1.850

100+ parts

$1.804

1k+ parts

$1.794

10k+ parts

-

709,864

$1.850

$1.804

$1.794

-

Corphita

USA . 63 parts In-Stock

1+ parts

$1.962

100+ parts

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63

$1.962

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Parana Technologies

USA . 2,303 parts In-Stock

1+ parts

$9.598

100+ parts

-

1k+ parts

$8.926

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2,303

$9.598

-

$8.926

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IDEA Electronic Components Group

UK . 720 parts In-Stock

1+ parts

$10.320

100+ parts

-

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$9.804

10k+ parts

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720

$10.320

-

$9.804

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DigiPath Technology Company

USA . 2,038 parts In-Stock

1+ parts

$16.099

100+ parts

$15.455

1k+ parts

-

10k+ parts

$15.455

2,038

$16.099

$15.455

-

$15.455

RC Electronics

USA . 54,088 parts In-Stock

1+ parts

-

100+ parts

$2.770

1k+ parts

$2.520

10k+ parts

$2.430

54,088

-

$2.770

$2.520

$2.430

Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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30,000

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QUARKTWIN TECHNOLOGY LTD

USA . 24,830 parts In-Stock

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24,830

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

1+ parts

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5,880

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Perfect Parts

USA . 1,006 parts In-Stock

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1,006

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 455 parts In-Stock

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455

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Cyclops Electronics Ltd (Excess)

UK . 316 parts In-Stock

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316

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Glotronic Ltd.

UK . 253 parts In-Stock

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253

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Overview

Enhance your cellphone's performance with the HMC422MS8ETR by Analog Devices. Manufactured with top-quality materials and advanced technology, this RF and baseband circuit IC offers unmatched reliability and efficiency for your device. Whether you're looking to improve signal strength, enhance data processing speed, or optimize power consumption, this small outline, thin profile component delivers exceptional value and benefits. Trust Analog Devices to provide cutting-edge solutions for all your telecom needs. Upgrade your cellphone experience today with the HMC422MS8ETR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the cellphone IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the cellphone IC onto a circuit board, saving time and reducing manufacturing costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this cellphone IC can withstand harsh environmental conditions and maintain reliable performance.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures compatibility with a wide range of devices and power sources, making this cellphone IC versatile and easy to integrate.

Technical Specifications

Cellphone ICs HMC422MS8ETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

HMC422MS8ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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