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MAX2676EWT+T

Analog Devices

MAX2676EWT+T by Analog Devices

MAX2676EWT+T by Analog Devices is a CELLPHONE IC with BICMOS tech. Features include 3.3V supply, -40 to 85 °C temp range, and RF/BASEBAND circuitry. Package: GRID ARRAY, 0.4mm pitch, 1.27x.865x.69mm dimensions for compact telecom applications.

Median Price

-

Lifecycle Status

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5

In-Stock Inventory

1k+

MAX2676EWT+T by Analog Devices
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 17,500 parts In-Stock

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17,500

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Chip Stock

USA . 3,077 parts In-Stock

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Anansix

USA . 2,280 parts In-Stock

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2,280

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Digiode

USA . 1,368 parts In-Stock

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Vyrian

USA . 963 parts In-Stock

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963

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MARBEL Systems

Belgium . 50 parts In-Stock

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$14.832

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50

$14.832

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Texas Native Microelectronics

USA . 800 parts In-Stock

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$17.048

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$15.855

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$15.002

800

$17.048

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$15.002

Advanced Electronics

New Zealand . 43 parts In-Stock

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$18.691

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$17.009

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$15.327

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43

$18.691

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Kenton Components

USA . 1,245 parts In-Stock

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$20.458

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$18.003

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$18.003

Qasali Group International

UK . 461 parts In-Stock

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$46.030

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Semicontronic

India . 12,319 parts In-Stock

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$747.000

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$728.325

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$724.590

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QUARKTWIN TECHNOLOGY LTD

USA . 25,789 parts In-Stock

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Corphita

USA . 3,092 parts In-Stock

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Overview

Unleash the power of connectivity with the MAX2676EWT+T by Analog Devices. Crafted with precision and expertise, this innovative Cellphone IC offers unparalleled performance and reliability. From enhancing signal strength to optimizing data transfer, this product ensures seamless communication in any mobile device. Experience the ultimate in quality and efficiency with Analog Devices, where cutting-edge technology meets exceptional value. Elevate your device's capabilities today with the MAX2676EWT+T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are often used for their durability and resistance to environmental factors, making this product a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of components, optimizing space on the circuit board and improving overall product design.

No. of Terminals: 6

Having a specific number of terminals simplifies the installation process and ensures compatibility with other components in the device.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions and maintain optimal performance even in elevated temperatures.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption for improved efficiency.

Nominal Supply Voltage: 3.3 V

Having a specific supply voltage ensures compatibility with other components and simplifies power management within the device.

Technical Specifications

Cellphone ICs MAX2676EWT+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e2

Length:

1.27 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.69 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.865 mm

Trade Compliance

MAX2676EWT+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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