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LMH2100TM/NOPB

Texas Instruments

LMH2100TM/NOPB by Texas Instruments

LMH2100TM/NOPB by Texas Instruments is a Cellphone IC with 6 terminals in a rectangular package. It operates b/w -40 to 85°C, with a supply current of 9.2mA at 2.7V. Ideal for RF and baseband circuits due to its thin profile and fine pitch grid array design.

Median Price

$2.730

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,215 parts In-Stock

1+ parts

$2.895

100+ parts

$2.536

1k+ parts

$1.433

10k+ parts

-

15,215

$2.895

$2.536

$1.433

-

Mouser Electronics

USA . 241 parts In-Stock

1+ parts

$4.110

100+ parts

$2.590

1k+ parts

$2.260

10k+ parts

$2.240

241

$4.110

$2.590

$2.260

$2.240

Rochester

USA . 20,762 parts In-Stock

1+ parts

-

100+ parts

$2.070

1k+ parts

$1.850

10k+ parts

$1.740

20,762

-

$2.070

$1.850

$1.740

DigiKey

USA . 20,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.730

10k+ parts

-

20,762

-

-

$2.730

-

Verical

USA . 19,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.313

10k+ parts

$2.175

19,500

-

-

$2.313

$2.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,979 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,979

$1.890

-

-

-

Vyrian

USA . 1,725 parts In-Stock

1+ parts

$1.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,725

$1.990

-

-

-

DigiKey Marketplace

USA . 20,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,762

-

-

-

-

Anansix

USA . 1,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

-

-

-

-

Prism Electronics

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,937 parts In-Stock

1+ parts

$1.791

100+ parts

-

1k+ parts

-

10k+ parts

-

4,937

$1.791

-

-

-

Component Stockers USA

USA . 24,861 parts In-Stock

1+ parts

$2.020

100+ parts

$1.890

1k+ parts

$1.520

10k+ parts

$1.520

24,861

$2.020

$1.890

$1.520

$1.520

Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

$13.062

100+ parts

-

1k+ parts

$13.556

10k+ parts

-

1,934

$13.062

-

$13.556

-

ChromeModa Solutions

Germany . 6,750 parts In-Stock

1+ parts

$14.676

100+ parts

$12.034

1k+ parts

-

10k+ parts

-

6,750

$14.676

$12.034

-

-

IDEA Electronic Components Group

UK . 1,991 parts In-Stock

1+ parts

$14.676

100+ parts

$13.942

1k+ parts

$13.208

10k+ parts

-

1,991

$14.676

$13.942

$13.208

-

A-Z Elektronik GmbH

Germany . 4,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,557

-

-

-

-

Alle Elektronik GmbH

Germany . 3,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,038

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Perfect Parts

USA . 2,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,223

-

-

-

-

DigiPath Technology Company

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

$13.232

1k+ parts

-

10k+ parts

-

1,700

-

$13.232

-

-

Overview

Unlock the full potential of your cellphone with the LMH2100TM/NOPB by Texas Instruments. This cutting-edge Cellphone IC offers unmatched quality and reliability, backed by the trusted name of Texas Instruments. From enhancing RF and baseband circuits to optimizing overall performance, this innovative product ensures seamless communication and connectivity. Experience the value and benefits of superior technology with the LMH2100TM/NOPB, designed for industrial-grade applications that demand nothing but the best. Elevate your cellphone experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Allows for easy and convenient integration onto a circuit board, saving time and effort during production.

Maximum Seated Height: 0.675 mm

Low profile design helps in space-constrained applications where height is a critical factor.

Nominal Supply Voltage: 2.7 V

Operates efficiently at a low voltage, saving power and making it suitable for mobile devices.

Terminal Pitch: 0.4 mm

Fine pitch terminals enable high density mounting, ideal for compact devices with limited space.

Technical Specifications

Cellphone ICs LMH2100TM/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.244 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Current:

9.2 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.844 mm

Trade Compliance

LMH2100TM/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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