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LMH2110TM/NOPB

Texas Instruments

LMH2110TM/NOPB by Texas Instruments

LMH2110TM/NOPB by Texas Instruments is a Cellphone IC with 6 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, with a supply current of 5.5mA at 4.5V. This RF and baseband circuit is ideal for telecom applications due to its thin profile and fine pitch design.

Median Price

$2.157

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 132,670 parts In-Stock

1+ parts

$2.157

100+ parts

$1.890

1k+ parts

$1.068

10k+ parts

-

132,670

$2.157

$1.890

$1.068

-

Chip1Stop

Japan . 468 parts In-Stock

1+ parts

$3.150

100+ parts

$1.930

1k+ parts

$1.670

10k+ parts

$1.600

468

$3.150

$1.930

$1.670

$1.600

DigiKey

USA . 1,974 parts In-Stock

1+ parts

$3.160

100+ parts

$1.957

1k+ parts

$1.759

10k+ parts

$1.684

1,974

$3.160

$1.957

$1.759

$1.684

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.285

1,000

-

-

$1.413

$1.285

Rochester

USA . 43 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.370

10k+ parts

$1.290

43

-

$1.530

$1.370

$1.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,476 parts In-Stock

1+ parts

$1.406

100+ parts

-

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1,476

$1.406

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.863

100+ parts

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100

$1.863

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Chip Stock

USA . 25,000 parts In-Stock

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25,000

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Vyrian

USA . 22,546 parts In-Stock

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22,546

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Anansix

USA . 2,098 parts In-Stock

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2,098

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Bristol Electronics

USA . 296 parts In-Stock

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296

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Atlantic Semiconductor

USA . 296 parts In-Stock

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296

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 22,524 parts In-Stock

1+ parts

$1.200

100+ parts

$1.170

1k+ parts

$1.164

10k+ parts

-

22,524

$1.200

$1.170

$1.164

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Corphita

USA . 1,891 parts In-Stock

1+ parts

$1.332

100+ parts

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1,891

$1.332

-

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Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$1.863

100+ parts

$1.770

1k+ parts

$1.681

10k+ parts

$1.658

40

$1.863

$1.770

$1.681

$1.658

Continental Prestige Electronics

USA . 6,331 parts In-Stock

1+ parts

$1.863

100+ parts

-

1k+ parts

-

10k+ parts

$1.826

6,331

$1.863

-

-

$1.826

Argo Parts USA

USA . 3,853 parts In-Stock

1+ parts

$1.863

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-

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3,853

$1.863

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Ampacity Inc.

Singapore . 22,727 parts In-Stock

1+ parts

$2.610

100+ parts

-

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22,727

$2.610

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Corohmni

South Africa . 381 parts In-Stock

1+ parts

$14.230

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381

$14.230

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Parana Technologies

USA . 128 parts In-Stock

1+ parts

$14.762

100+ parts

-

1k+ parts

$15.197

10k+ parts

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128

$14.762

-

$15.197

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DigiPath Technology Company

USA . 1,344 parts In-Stock

1+ parts

$16.254

100+ parts

$14.954

1k+ parts

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1,344

$16.254

$14.954

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ChromeModa Solutions

Germany . 1,127 parts In-Stock

1+ parts

$16.586

100+ parts

$13.601

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1,127

$16.586

$13.601

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IDEA Electronic Components Group

UK . 131 parts In-Stock

1+ parts

$16.586

100+ parts

$15.757

1k+ parts

$14.927

10k+ parts

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131

$16.586

$15.757

$14.927

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Lixinc

USA . 11,337 parts In-Stock

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11,337

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 2,446 parts In-Stock

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2,446

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Speed Components Ltd (Excess)

Israel . 1,610 parts In-Stock

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1,610

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Perfect Parts

USA . 1,426 parts In-Stock

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1,426

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Overview

Unlock the power of your cellphone with the LMH2110TM/NOPB by Texas Instruments. This high-quality Cellphone IC boasts advanced technology and reliable performance, making it the perfect choice for your mobile device needs. With a sleek rectangular design and top-of-the-line package style, this IC offers unmatched value and benefits to customers. Whether you're looking to enhance your phone's RF and baseband circuit or improve overall functionality, the LMH2110TM/NOPB is sure to exceed your expectations. Upgrade your cellphone experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for mobile devices.

Surface Mount: YES

This feature allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Nominal Supply Voltage: 4.5 V

The nominal supply voltage of 4.5V is commonly used in mobile devices, making this IC compatible with a wide range of applications.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This IC is designed specifically for RF and baseband circuits in cellphones, ensuring optimized performance for communication functions.

Technical Specifications

Cellphone ICs LMH2110TM/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.24 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Current:

5.5 mA

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.84 mm

Trade Compliance

LMH2110TM/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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