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HMC421QS16

Analog Devices

HMC421QS16 by Analog Devices

Analog Devices' HMC421QS16 is a cellphone IC with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,495 parts In-Stock

1+ parts

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8,495

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Digiode

USA . 801 parts In-Stock

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801

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Mil-Aero Solutions, Inc.

USA . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 555 parts In-Stock

1+ parts

$7.968

100+ parts

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555

$7.968

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Parana Technologies

USA . 4,038 parts In-Stock

1+ parts

$10.613

100+ parts

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$9.870

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4,038

$10.613

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$9.870

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IDEA Electronic Components Group

UK . 489 parts In-Stock

1+ parts

$11.412

100+ parts

$10.841

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$10.841

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489

$11.412

$10.841

$10.841

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DigiPath Technology Company

USA . 211 parts In-Stock

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$17.803

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$17.091

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$17.091

211

$17.803

$17.091

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$17.091

Semicontronic

India . 692 parts In-Stock

1+ parts

$362.000

100+ parts

$352.950

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$351.140

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692

$362.000

$352.950

$351.140

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One Stop Electronics

USA . 834 parts In-Stock

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$546.000

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834

$546.000

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Corphita

USA . 760 parts In-Stock

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760

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Overview

Upgrade your cellphone experience with the HMC421QS16 by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that are designed to optimize performance and enhance functionality. This small outline, shrink pitch package offers a wide range of applications in RF and baseband circuits, making it an essential component for telecommunications technology. With a nominal supply voltage of 5V and industrial temperature grade, this product ensures superior operation in various conditions. Trust Analog Devices to deliver unmatched value and benefits with the HMC421QS16.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for efficient assembly and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular shape is easy to integrate into circuit designs and allows for efficient use of space.

No. of Terminals: 16

Having 16 terminals enables the IC to support complex circuit connections and functionalities.

Package Style: SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design contribute to higher component density on the PCB, ideal for compact mobile devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function effectively even in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring stable electrical connections.

Terminal Position: DUAL

Dual terminal position enhances signal integrity and enables efficient data transfer.

Maximum Seated Height: 1.75 mm

Low seated height makes the IC suitable for slim and compact device designs.

Width: 3.9 mm

Compact width dimension allows for efficient use of PCB space and integration into small form factor devices.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures reliable solder joints during assembly processes.

Length: 4.9 mm

Optimal length dimension for compact circuit layouts and space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh operating environments, making it suitable for industrial applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering, enhancing the overall reliability of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supports both RF and baseband circuit functionalities, making it versatile for telecom applications requiring multi-functional integration.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage supports efficient operation of the IC and ensures consistent performance.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density circuit designs and minimizes signal interference for improved overall performance.

Technical Specifications

Cellphone ICs HMC421QS16 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HMC421QS16 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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