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MAX2010ETI+T

Analog Devices

MAX2010ETI+T by Analog Devices

MAX2010ETI+T by Analog Devices is a Cellphone IC with 28 terminals, BICMOS technology, and 5V supply voltage. It operates b/w -40 to 85 °C, suitable for RF and baseband circuits in telecom applications due to its compact square package style and low supply current of 0.0121mA.

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MAX2010ETI+T by Analog Devices
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Vyrian

USA . 5,700 parts In-Stock

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5,700

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Anansix

USA . 2,718 parts In-Stock

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2,718

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Digiode

USA . 1,681 parts In-Stock

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1,681

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MARBEL Systems

Belgium . 1,908 parts In-Stock

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$8.016

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1,908

$8.016

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$9.214

100+ parts

$8.845

1k+ parts

$8.569

10k+ parts

$8.108

100

$9.214

$8.845

$8.569

$8.108

Kenton Components

USA . 472 parts In-Stock

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$11.057

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$9.730

472

$11.057

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$9.730

AZTECH Wire

Italy . 545 parts In-Stock

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$12.712

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545

$12.712

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Qasali Group International

UK . 1,795 parts In-Stock

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$24.878

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$23.136

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$21.892

1,795

$24.878

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$23.136

$21.892

Semicontronic

India . 1,468 parts In-Stock

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$390.000

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$380.250

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$378.300

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One Stop Electronics

USA . 1,867 parts In-Stock

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$479.000

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Corphita

USA . 2,756 parts In-Stock

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Overview

Unleash the power of your cellphone with the MAX2010ETI+T by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch quality and reliability. This versatile Cellphone IC is perfect for a wide range of applications, providing seamless integration and high performance. With its surface mount capability and low power consumption, this product offers exceptional value and benefits to customers looking for efficient and reliable solutions. Upgrade your device today with the MAX2010ETI+T and experience enhanced functionality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and replacement, making this product convenient and versatile.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient design for the cellphone IC, making it suitable for small electronic devices.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with standard power sources, making integration with existing systems seamless.

No. of Terminals: 28

With 28 terminals, this cellphone IC offers a wide range of connectivity options, enhancing its functionality and versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design, enhancing performance and usability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the cellphone IC to withstand harsh environmental conditions, ensuring reliability and durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enhances the versatility of the cellphone IC, making it suitable for use in diverse climates and environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides durability and corrosion resistance, ensuring long-lasting performance of the cellphone IC.

Terminal Position: QUAD

The quad terminal position allows for efficient connectivity and signal transmission, improving the overall functionality of the cellphone IC.

Width: 5 mm

The compact width of 5mm enables the cellphone IC to be easily integrated into small electronic devices, making it a versatile choice for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures quick and efficient installation or rework processes, saving time and effort.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering and bonding, enhancing the performance and longevity of the cellphone IC.

Length: 5 mm

The compact length of 5mm allows for easy integration of the cellphone IC into electronic devices with limited space, making it a versatile and practical choice.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the cellphone IC can withstand extreme temperature fluctuations, making it suitable for use in industrial applications.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, providing high performance, low power consumption, and versatility for the cellphone IC.

Terminal Form: NO LEAD

The no-lead terminal form reduces environmental impact and ensures compliance with regulations, making this product an eco-friendly choice.

Maximum Supply Current: 0.0121 mA

The low maximum supply current of 0.0121 mA minimizes power consumption, making the cellphone IC energy-efficient and cost-effective to operate.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry in one package provides high-performance communication capabilities, making the cellphone IC ideal for telecommunications applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts ensures compatibility with standard power sources, simplifying system integration and deployment.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the cellphone IC allows for fine-pitch connections, enabling high-density integration and miniaturization of electronic devices.

Technical Specifications

Cellphone ICs MAX2010ETI+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0121 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2010ETI+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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