Loading...

CC1150RGVT

Texas Instruments

CC1150RGVT by Texas Instruments

The Texas Instruments CC1150RGVT is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and data rate of 0.5 Mbps. This surface-mount IC has 16 terminals in a square shape, ideal for industrial applications requiring compact design and high performance.

Median Price

$3.018

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,846 parts In-Stock

1+ parts

$2.487

100+ parts

$2.179

1k+ parts

$1.231

10k+ parts

-

4,846

$2.487

$2.179

$1.231

-

DigiKey

USA . 248 parts In-Stock

1+ parts

$3.550

100+ parts

$2.664

1k+ parts

$2.373

10k+ parts

$2.222

248

$3.550

$2.664

$2.373

$2.222

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,155 parts In-Stock

1+ parts

$2.363

100+ parts

-

1k+ parts

-

10k+ parts

-

4,155

$2.363

-

-

-

Chip Stock

USA . 25,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,300

-

-

-

-

Vyrian

USA . 5,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,078

-

-

-

-

Cogito LLC

Ukraine . 234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

234

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,255 parts In-Stock

1+ parts

$2.238

100+ parts

-

1k+ parts

-

10k+ parts

-

3,255

$2.238

-

-

-

Component Stockers USA

USA . 164 parts In-Stock

1+ parts

$3.430

100+ parts

$2.510

1k+ parts

-

10k+ parts

-

164

$3.430

$2.510

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$9.734

100+ parts

$8.858

1k+ parts

$7.982

10k+ parts

-

10

$9.734

$8.858

$7.982

-

Parana Technologies

USA . 1,545 parts In-Stock

1+ parts

$14.145

100+ parts

-

1k+ parts

$14.604

10k+ parts

-

1,545

$14.145

-

$14.604

-

DigiPath Technology Company

USA . 1,883 parts In-Stock

1+ parts

$15.575

100+ parts

-

1k+ parts

-

10k+ parts

-

1,883

$15.575

-

-

-

ChromeModa Solutions

Germany . 6,828 parts In-Stock

1+ parts

$15.893

100+ parts

$13.032

1k+ parts

-

10k+ parts

-

6,828

$15.893

$13.032

-

-

IDEA Electronic Components Group

UK . 2,272 parts In-Stock

1+ parts

$15.893

100+ parts

$15.098

1k+ parts

$14.304

10k+ parts

-

2,272

$15.893

$15.098

$14.304

-

A-Z Elektronik GmbH

Germany . 6,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,614

-

-

-

-

Alle Elektronik GmbH

Germany . 4,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,409

-

-

-

-

Northwest PG Solutions

USA . 1,392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,392

-

-

-

-

Native Components

USA . 824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

824

-

-

-

-

Kepictronics

USA . 203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

203

-

-

-

-

Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$12.498

1k+ parts

$11.573

10k+ parts

$11.573

100

-

$12.498

$11.573

$11.573

Overview

Enhance your cellphone's performance with the Texas Instruments CC1150RGVT, a top-quality RF and baseband circuit designed for seamless communication. With a robust package body made of plastic/epoxy and advanced CMOS technology, this IC ensures reliable operation in industrial environments. Whether you're looking to improve signal transmission or enhance connectivity, this versatile chip carrier offers the perfect solution. Trust Texas Instruments' reputation for excellence and innovation, and unlock the full potential of your device with the CC1150RGVT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the cellphone IC, ensuring reliability in various environmental conditions.

Surface Mount: YES

Being surface mountable makes installation of the IC easier and more efficient, saving time and effort during production.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to perform reliably even in challenging industrial environments with elevated temperatures.

Technology: CMOS

The CMOS technology used in the IC ensures low power consumption and high speed operation, making it energy efficient and suitable for modern mobile devices.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in mobile devices, ensuring compatibility and efficient power consumption.

Technical Specifications

Cellphone ICs CC1150RGVT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Data Rate:

.5 Mbps

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC1150RGVT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20