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AFE7799IABJ

Texas Instruments

AFE7799IABJ by Texas Instruments

AFE7799IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C and features RF AND BASEBAND CIRCUIT for telecom applications. The package measures 17x17 mm with a terminal pitch of 0.8mm, making it suitable for compact mobile devices.

Median Price

$729.928

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,453 parts In-Stock

1+ parts

$729.928

100+ parts

$660.710

1k+ parts

$629.248

10k+ parts

-

2,453

$729.928

$660.710

$629.248

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,265 parts In-Stock

1+ parts

$693.432

100+ parts

-

1k+ parts

-

10k+ parts

-

3,265

$693.432

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-

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Vyrian

USA . 5,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,172

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-

-

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Chip Stock

USA . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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375

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 272 parts In-Stock

1+ parts

$0.412

100+ parts

-

1k+ parts

-

10k+ parts

$0.395

272

$0.412

-

-

$0.395

Northwest PG Solutions

USA . 2,369 parts In-Stock

1+ parts

$0.453

100+ parts

-

1k+ parts

-

10k+ parts

$0.399

2,369

$0.453

-

-

$0.399

Parana Technologies

USA . 707 parts In-Stock

1+ parts

$12.344

100+ parts

$1,146.356

1k+ parts

$11.110

10k+ parts

-

707

$12.344

$1,146.356

$11.110

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DigiPath Technology Company

USA . 112 parts In-Stock

1+ parts

$13.593

100+ parts

-

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10k+ parts

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112

$13.593

-

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IDEA Electronic Components Group

UK . 524 parts In-Stock

1+ parts

$13.870

100+ parts

$13.176

1k+ parts

$12.483

10k+ parts

-

524

$13.870

$13.176

$12.483

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ChromeModa Solutions

Germany . 309 parts In-Stock

1+ parts

$13.870

100+ parts

$11.373

1k+ parts

-

10k+ parts

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309

$13.870

$11.373

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-

AZTECH Wire

Italy . 690 parts In-Stock

1+ parts

$15.470

100+ parts

-

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690

$15.470

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Corphita

USA . 1,447 parts In-Stock

1+ parts

$656.935

100+ parts

-

1k+ parts

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1,447

$656.935

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QUARKTWIN TECHNOLOGY LTD

USA . 27,153 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27,153

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-

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Lixinc

USA . 5,916 parts In-Stock

1+ parts

-

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1k+ parts

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5,916

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,000

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Overview

Elevate your cellphone performance with the AFE7799IABJ by Texas Instruments. Manufactured with precision and expertise, this Cellphone IC offers unparalleled quality and reliability. Designed for seamless integration, this product is ideal for applications in RF and baseband circuits. Experience enhanced functionality and efficiency with its advanced features. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Unlock the potential of your device with the AFE7799IABJ today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the cellphone IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount design allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

No. of Terminals: 400

The high number of terminals allows for a more intricate and capable cellphone IC, offering a wide range of functions and features.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this cellphone IC can operate reliably even in demanding conditions without overheating.

Temperature Grade: INDUSTRIAL

Industrial grade temperature tolerance ensures stable performance in various environments, making this cellphone IC suitable for industrial applications.

Technical Specifications

Cellphone ICs AFE7799IABJ attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Additional Features:

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

AFE7799IABJ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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