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HMC497LP4TR

Analog Devices

HMC497LP4TR by Analog Devices

Analog Devices' HMC497LP4TR is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, operates at 5V, and has a terminal pitch of 0.5mm for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,927 parts In-Stock

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5,927

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Digiode

USA . 87 parts In-Stock

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87

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Bristol Electronics

USA . 46 parts In-Stock

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46

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 259 parts In-Stock

1+ parts

$7.078

100+ parts

-

1k+ parts

$6.583

10k+ parts

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259

$7.078

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$6.583

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IDEA Electronic Components Group

UK . 460 parts In-Stock

1+ parts

$7.611

100+ parts

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$7.230

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460

$7.611

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$7.230

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DigiPath Technology Company

USA . 1,868 parts In-Stock

1+ parts

$11.873

100+ parts

$11.398

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$11.398

1,868

$11.873

$11.398

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$11.398

AZTECH Wire

Italy . 547 parts In-Stock

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$13.673

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547

$13.673

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Semicontronic

India . 817 parts In-Stock

1+ parts

$455.000

100+ parts

$443.625

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$441.350

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817

$455.000

$443.625

$441.350

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One Stop Electronics

USA . 897 parts In-Stock

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$502.000

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897

$502.000

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Corphita

USA . 474 parts In-Stock

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474

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Overview

Elevate your cellphone performance with the HMC497LP4TR by Analog Devices. Known for their top-notch quality and reliable products, Analog Devices delivers cutting-edge Cellphone ICs that are essential for optimal device functionality. With a focus on innovation and efficiency, this product offers unparalleled value to customers seeking improved connectivity and enhanced mobile capabilities. Whether you're looking to boost RF and baseband circuit performance or streamline communication processes, the HMC497LP4TR is the ultimate solution for all your smartphone needs. Elevate your mobile experience today with Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

Square package shape optimizes space utilization and ensures a compact design for the product.

Power Supplies (V): 5

Operating at 5V nominal supply voltage ensures compatibility with standard power sources and offers stable performance.

No. of Terminals: 24

With 24 terminals, this product provides ample connectivity options for various input/output requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances heat dissipation and ensures efficient performance in a compact package.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C allows the product to withstand high-temperature environments and ensures reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C enables the product to function in extremely cold conditions, making it suitable for a wide range of operating environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides corrosion resistance and ensures secure connections for long-lasting performance.

Terminal Position: QUAD

Quad terminal position offers enhanced connectivity options and facilitates easy integration into circuit designs.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this product enables a low-profile installation, ideal for compact electronic devices.

Width: 4 mm

Having a width of 4mm contributes to the product's compact design and space-saving characteristics.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235 °C, this product can withstand high-temperature soldering processes, ensuring reliable assembly.

Length: 4 mm

Measuring 4mm in length, this product offers a compact footprint, making it suitable for portable and space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the temperature and reliability requirements of industrial environments.

Terminal Form: NO LEAD

Having a no-lead terminal form improves environmental sustainability and complies with regulations regarding hazardous substances in electronics.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Capable of handling RF and baseband circuit functions, this product is versatile and suitable for telecommunications applications requiring signal processing and transmission.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies integration into existing systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides precise and compact terminal spacing, enabling high-density PCB layouts and reducing the overall footprint of the product.

Technical Specifications

Cellphone ICs HMC497LP4TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC497LP4TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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