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HMC993LP5E

Analog Devices

HMC993LP5E by Analog Devices

Analog Devices' HMC993LP5E is a 32-terminal cellphone IC in a square chip carrier package. With an operating temperature range of -40 to 85°C, it's ideal for industrial telecom applications requiring RF and baseband circuit integration. The IC operates at a nominal voltage of 5V and features matte tin terminal finish with no lead.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,035 parts In-Stock

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3,035

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Digiode

USA . 558 parts In-Stock

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558

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Distributors (Availability)

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AZTECH Wire

Italy . 189 parts In-Stock

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$10.344

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189

$10.344

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Parana Technologies

USA . 1,233 parts In-Stock

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$10.652

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$9.907

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$10.652

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

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$11.454

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$10.881

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$10.881

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1,406

$11.454

$10.881

$10.881

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DigiPath Technology Company

USA . 363 parts In-Stock

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$17.868

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$17.154

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$17.154

363

$17.868

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$17.154

Semicontronic

India . 800 parts In-Stock

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$619.000

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$603.525

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$600.430

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800

$619.000

$603.525

$600.430

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One Stop Electronics

USA . 574 parts In-Stock

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$720.000

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Perfect Parts

USA . 997 parts In-Stock

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Corphita

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Overview

Enhance the performance of your cellphone devices with the HMC993LP5E from Analog Devices, a leading manufacturer known for top-quality products. This Cellphone IC offers advanced RF and baseband circuitry, ensuring seamless connectivity and optimal functionality. With its compact chip carrier design and industrial temperature grade, this IC is perfect for various telecom applications. Experience the reliability and efficiency that Analog Devices is renowned for, and elevate your product offerings with the HMC993LP5E. Upgrade your devices today and stay ahead of the competition with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for easy assembly and saves space on the PCB, making the cellphone ICs more compact.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the cellphone ICs can handle rigorous usage without overheating.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, these ICs are compatible with standard power sources, ensuring reliable performance.

Technical Specifications

Cellphone ICs HMC993LP5E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

HMC993LP5E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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