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HMC900LP5E

Analog Devices

HMC900LP5E by Analog Devices

Analog Devices' HMC900LP5E is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Features include matte tin finish, no-lead terminal form, and nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,304 parts In-Stock

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5,304

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Digiode

USA . 848 parts In-Stock

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848

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Prism Electronics

USA . 22 parts In-Stock

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22

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Goldney Electronics S.L.

Spain . 19 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 780 parts In-Stock

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$13.191

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780

$13.191

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Parana Technologies

USA . 1,301 parts In-Stock

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$15.418

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$14.338

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1,301

$15.418

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$14.338

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IDEA Electronic Components Group

UK . 1,471 parts In-Stock

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$16.578

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$15.749

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$15.749

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1,471

$16.578

$15.749

$15.749

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DigiPath Technology Company

USA . 600 parts In-Stock

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$25.862

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$24.827

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$24.827

600

$25.862

$24.827

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$24.827

Component Stockers USA

USA . 288 parts In-Stock

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$99.990

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288

$99.990

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Semicontronic

India . 1,032 parts In-Stock

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$243.000

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$236.925

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$235.710

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1,032

$243.000

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One Stop Electronics

USA . 864 parts In-Stock

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$744.000

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$744.000

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Corphita

USA . 216 parts In-Stock

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Overview

Unlock the potential of your cellphone with the HMC900LP5E by Analog Devices. Designed with precision and quality in mind, this innovative Cellphone IC offers unparalleled performance and reliability. From baseband circuits to advanced telecom applications, this versatile device ensures seamless functionality and optimal efficiency. With its cutting-edge technology and industrial-grade components, the HMC900LP5E delivers exceptional value, empowering you to stay connected and productive wherever you go. Trust Analog Devices for superior solutions that elevate your mobile experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for portable devices like cellphones.

Surface Mount: YES

The surface mount feature allows for easier and more efficient assembly of the product onto circuit boards, saving time and cost during production.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and conductivity, ensuring reliable connections for optimal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand extended periods of use without overheating or malfunctioning.

Nominal Supply Voltage: 5 V

The 5V supply voltage is commonly used in cellphone applications, providing compatibility and reliable power for the device.

Technical Specifications

Cellphone ICs HMC900LP5E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

HMC900LP5E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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