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MC13142D

NXP Semiconductors

MC13142D by NXP Semiconductors

MC13142D by NXP Semiconductors is a cellphone IC with 16 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications. The small outline package style with gull wing terminals makes it suitable for industrial-grade usage.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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4 Star Electronics, Inc.

USA . 3,527 parts In-Stock

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Vyrian

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Anansix

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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R&J Components

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Mil-Aero Solutions, Inc.

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Prism Electronics

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One Stop Electronics

USA . 1,696 parts In-Stock

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Ampacity Inc.

Singapore . 1,428 parts In-Stock

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UNI Independent Distributors

Spain . 6,347 parts In-Stock

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Argo Parts USA

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Corphita

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Kepictronics

USA . 1,770 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

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Assy Fe

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Overview

Unlock the power of seamless connectivity with the MC13142D by NXP Semiconductors. This high-quality Cellphone IC boasts a range of applications, providing unparalleled performance and reliability. Designed with precision by a trusted manufacturer, this product offers customers value and benefits that are unmatched in the industry. Experience the advantage of cutting-edge technology with the MC13142D – your ultimate solution for all your cellphone IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making it ideal for portable devices such as cellphones.

Surface Mount: YES

Surface mount technology allows for easy and cost-effective assembly of the IC onto the circuit board, saving space and reducing manufacturing time.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient placement on the circuit board and allows for easier integration into the overall design of the cellphone.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities within the IC, enhancing its performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand heat and maintain optimal performance even in demanding conditions.

Nominal Supply Voltage: 3 V

Operating at a low nominal supply voltage of 3V helps in reducing power consumption and extending battery life in the cellphone.

Technical Specifications

Cellphone ICs MC13142D attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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