Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
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Cellphone ICs MC13201FCR2 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MC13201FCR2 Telecommunications trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
LL4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
DRV5053VAQLPG
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
ULN2003ADR
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
Kec
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
LM317LMX/NOPB
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
Microsemi
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
ADF7020-1BCPZ-RL
Analog Devices
Analog Devices' ADF7020-1BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 3V, RF and baseband circuitry, and a compact square package suitable for telecom applications.
ADF7020-11BCPZ-RL7
Analog Devices ADF7020-11BCPZ-RL7 is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC2511F8RSP
Texas Instruments CC2511F8RSP is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it features CMOS technology, RF and baseband circuitry for telecom applications. With a nominal voltage of 3.3V, it has a compact size of 6x6mm and terminal pitch of 0.5mm.
AT86RF233-ZU
Atmel
HMC818LP4ETR
Analog Devices' HMC818LP4ETR is a 24-terminal cellphone IC in a square chip carrier package with very thin profile. It operates b/w -40 °C to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at 3V supply voltage.
ADF7025BCPZ
Analog Devices' ADF7025BCPZ is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. Ideal for baseband circuits, it has a very thin profile and matte tin finish for industrial telecom applications.
LMV226URX/NOPB
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
ADF4360-2BCP
Analog Devices' ADF4360-2BCP is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 3.3V supply, BICMOS technology, and a compact square package suitable for baseband circuits in telecom applications.
MAX5865E/D
Analog Devices' MAX5865E/D is a cellphone IC with CMOS technology, operating b/w -40 °C to 85°C. It features an unencased chip package, tin lead finish, and 3V supply voltage. Ideal for RF and baseband circuits in industrial-grade telecom applications.
CC1070-RTY1
CC1070-RTY1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable with a very thin profile, ideal for industrial telecom applications.
SARA-R422M10S-01B
U-blox Ag
RF AND BASEBAND CIRCUIT;
RFFM6903TR7
Qorvo
Qorvo's RFFM6903TR7 is a 28-terminal RF and baseband circuit IC for cellphones. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. The package style is grid array, suitable for industrial telecom applications.
TCM320AC57IDW
TCM320AC57IDW by Texas Instruments is a Cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a 13-bit linear coding and A-Law companding law, suitable for baseband circuit applications. This small outline package has a rectangular shape, gull wing terminal form, and requires a 5V supply voltage.
SARA-R500S-00B
LMH6521SQ/NOPB
LMH6521SQ/NOPB by Texas Instruments is a cellphone IC with 2 channels, RF and baseband circuit. It operates in industrial temperature range (-40 to 85°C) with a supply voltage of 5V. With a max gain tolerance of 26dB, it is suitable for telecom applications requiring high performance in compact square chip carrier package.
CC1050PWG3
CC1050PWG3 by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.
LMV226URX
LMV226URX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grade range from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This IC has 4 terminals, surface mount capability, and a nominal voltage of 2.7V.
TCM320AC57DW
Texas Instruments TCM320AC57DW is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features GULL WING terminals, 5V supply voltage, and is ideal for BASEBAND CIRCUIT applications in the telecom industry.
ADL5502ACBZ-P7
ADL5502ACBZ-P7 by Analog Devices is a CELLPHONE IC with BICMOS tech. Features include 3V supply, -40 to 85°C temp range, and RF/BASEBAND circuit type. Its GRID ARRAY package has 8 terminals, 0.5mm pitch, and measures 1.46mm in length/width for telecom applications.
LMV227SD/NOPB
LMV227SD/NOPB by Texas Instruments is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
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MC13142D
NXP Semiconductors
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
Motorola
Freescale Semiconductor
MC13202FCR2
MC13191
MC13751FCR2
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
MC13145FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MC13191FCR2
MC13192
MC13146FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LFQFP; Package Shape: SQUARE;
MC13192FC
MC13201FC
MC13150FTB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
MC13202FC
MC13143D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MC13191FC
MC13192FCR2
MC13150FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LFQFP; Package Shape: SQUARE;
MC13193
MC13201FCR2
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