Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MC13202FCR2 by NXP Semiconductors is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
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$3.600
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$8.740
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$15.380
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$3.220
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$3.411
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$8.565
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A-Z Elektronik GmbH
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Perfect Parts
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ChipstoGo Electronic ltd
Provides a lightweight and durable housing for the cellphone ICs, ensuring longevity and easy handling.
Enables easy and efficient installation on the circuit board, saving time and effort during assembly.
Offers a compact form factor, maximizing space efficiency on the PCB.
Provides sufficient connection points for various functions and components within the cellphone ICs.
Combination of these styles allows for efficient heat dissipation and compact design, ideal for mobile devices.
Ensures stable performance even in high-temperature environments, improving reliability.
Allows the cellphone ICs to function effectively in cold conditions, expanding their usability.
Provides a reliable electrical connection and corrosion resistance for long-term performance.
Facilitates efficient routing of connections and signals within the package, optimizing performance.
Low profile design helps in reducing overall height of the device, making it suitable for slim and compact smartphones.
Compact width enables space-saving integration on the PCB, ideal for small form factor devices.
Allows for a controlled and efficient soldering process during manufacturing, ensuring high-quality connections.
Withstands high reflow temperatures during assembly, ensuring reliability and durability under harsh manufacturing conditions.
Compact length contributes to the overall small footprint of the cellphone ICs, maximizing space efficiency.
Designed to operate reliably in industrial environments with varying temperature ranges, ensuring consistent performance.
Environmentally friendly and compliant with regulations, making it a sustainable choice for electronic devices.
Provides integrated RF and baseband circuitry for efficient communication and data processing in cellphone applications.
Optimized supply voltage for efficient power management and performance of the cellphone ICs.
Fine pitch design allows for high-density connections, enabling complex functionality in a small form factor.
Designed to withstand moderate levels of moisture exposure, ensuring reliability in humid conditions.
Cellphone ICs MC13202FCR2 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
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Maximum Time At Peak Reflow Temperature (s):
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MC13202FCR2 Telecommunications trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
1N4148
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
1N4148WS
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
L7805CV
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Voltage-1: 5 V;
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Diotec Semiconductor Ag
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LMV228TLX/NOPB
Texas Instruments LMV228TLX/NOPB is a cellphone IC with surface mount, grid array package style, and industrial temperature grade. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. Max supply current is 8mA with peak reflow temp of 260°C.
ADF7901BRUZ-RL7
Analog Devices
Analog Devices' ADF7901BRUZ-RL7 is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures from 0 to 50 °C, with a supply voltage of 3V. This RF and baseband circuit is designed for telecom applications requiring surface mount technology.
TRF371135IRGZR
TRF371135IRGZR by Texas Instruments is a 48-terminal cellphone IC with a 5V supply voltage. It features RF and baseband circuits, operates in industrial temperature range (-40 to 85°C), and has a package style of chip carrier. Ideal for telecom applications requiring high-performance RF solutions.
MAX5864ETM+T
Analog Devices' MAX5864ETM+T is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, CMOS technology, and RF/baseband circuit make it ideal for industrial telecom applications. Terminal pitch of 0.5mm and no-lead terminal form ensure compact design and efficient performance.
SKY53735-21
Skyworks Solutions
SKY53735-21 by Skyworks Solutions is a Cellphone IC with 47 terminals in a rectangular chip carrier package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a low profile of 0.7mm, it features no-lead terminals and requires a nominal voltage of 1.8V.
ADRV9010BBCZ-A
Analog Devices' ADRV9010BBCZ-A is a cellphone IC with 289 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 110°C and has a nominal voltage of 1V. This RF and baseband circuit is ideal for telecom applications requiring precise signal processing.
TLV320AC57CDW
TLV320AC57CDW by Texas Instruments is a 20-terminal cellphone IC with 3V supply voltage. It features A-LAW companding law, 13-bit linear coding, and a filter. Ideal for baseband circuits in telecom applications due to its small outline package and commercial temperature grade.
CC2420Z-RTR1
CC2420Z-RTR1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable and suitable for industrial applications requiring a compact form factor.
CC2420-RTR1
CC2420-RTR1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and CMOS technology. Ideal for telecom applications, this surface-mount chip carrier has a compact square package style with nickel palladium gold finish.
HMC377QS16G
Analog Devices' HMC377QS16G is a cellphone IC with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
CC1000PWG3
CC1000PWG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with shrink pitch, suitable for industrial applications.
CC1021-RTB1
CC1021-RTB1 by Texas Instruments is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V and terminal pitch of 0.65mm, making it ideal for telecom applications.
AD8340ACPZ-REEL7
AD8340ACPZ-REEL7 by Analog Devices is a cellphone IC with 24 terminals, operating at -40 to 85 °C. It features a 5V supply, 0.15mA current, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable and has a very thin profile for industrial telecom applications.
ADL5561ACPZ-R7
ADL5561ACPZ-R7 by Analog Devices is a 16-terminal cellphone IC with a square shape and chip carrier package style. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a nominal voltage of 3.3V, it features RF and baseband circuits for high-performance communication systems.
TC5584IUF#TRPBF
Analog Devices' TC5584IUF#TRPBF is a cellphone IC with 24 terminals in a square chip carrier package. It features RF and baseband circuit for telecom applications, operates at 5V supply voltage, and has a terminal pitch of 0.5mm. Ideal for compact mobile devices due to its very thin profile and surface mount capability.
MAX2021ETX+T
Analog Devices' MAX2021ETX+T is a Cellphone IC with 36 terminals in a square package. Operating b/w -40 to 85 °C, it uses BICMOS technology and has a supply voltage of 5V. Ideal for baseband circuits, this IC has a max supply current of 0.315mA and terminal pitch of 0.5mm.
AD6643BCPZ-250
AD6643BCPZ-250 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style, -40 to 85°C temperature range, and RF and baseband circuit for telecom applications.
CC2511F8RSPR
The Texas Instruments CC2511F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuitry for telecom applications. With a compact size of 6x6mm and CMOS technology, it offers high performance in a small form factor suitable for mobile devices.
CC1101QRHBRG4Q1
CC1101QRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at 1.8/3.6V and data rate of 0.25 Mbps. It is an RF and baseband circuit suitable for automotive applications due to AEC-Q100 screening, -40 to 125°C temperature range, and moisture sensitivity level of 2.
CC2511F16RSPR
The Texas Instruments CC2511F16RSPR is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures from 0 to 85°C, with a supply voltage of 3.3V. This RF and baseband circuit features CMOS technology and has a terminal pitch of 0.5mm, making it suitable for various wireless communication applications.
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MC13142D
NXP Semiconductors
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
Motorola
Freescale Semiconductor
MC13201FCR2
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MC13191
MC13751FCR2
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
MC13145FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MC13191FCR2
MC13192
MC13146FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LFQFP; Package Shape: SQUARE;
MC13192FC
MC13201FC
MC13150FTB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
MC13202FC
MC13143D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MC13191FC
MC13192FCR2
MC13150FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LFQFP; Package Shape: SQUARE;
MC13193
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