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MC13192FCR2

NXP Semiconductors

MC13192FCR2 by NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$4.225

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,336 parts In-Stock

1+ parts

-

100+ parts

$3.380

1k+ parts

$3.030

10k+ parts

$2.850

6,336

-

$3.380

$3.030

$2.850

DigiKey

USA . 6,336 parts In-Stock

1+ parts

-

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$4.450

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6,336

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$4.450

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Verical

USA . 6,336 parts In-Stock

1+ parts

-

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$4.225

1k+ parts

$3.788

10k+ parts

$3.563

6,336

-

$4.225

$3.788

$3.563

Distributors (In-Stock)

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Digiode

USA . 2,478 parts In-Stock

1+ parts

$3.572

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$3.572

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Vyrian

USA . 2,105 parts In-Stock

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$3.760

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DigiKey Marketplace

USA . 7,066 parts In-Stock

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Anansix

USA . 2,063 parts In-Stock

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2,063

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LIBRA Elektronik GmbH

Germany . 1,629 parts In-Stock

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1,629

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Inventory MP

USA . 447 parts In-Stock

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447

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Bristol Electronics

USA . 447 parts In-Stock

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447

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LWI Electronics Inc

India . 4 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 6,377 parts In-Stock

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$3.200

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$3.200

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Corphita

USA . 3,359 parts In-Stock

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$3.384

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3,359

$3.384

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QUARKTWIN TECHNOLOGY LTD

USA . 11,598 parts In-Stock

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11,598

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UNI Independent Distributors

Spain . 6,154 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,232 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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Kepictronics

USA . 674 parts In-Stock

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Technical Specifications

Cellphone ICs MC13192FCR2 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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