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MC13202FC

NXP Semiconductors

MC13202FC by NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$4.260

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

MC13202FC by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 6,160 parts In-Stock

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6,160

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Rochester

USA . 318 parts In-Stock

1+ parts

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$4.260

1k+ parts

$3.810

10k+ parts

$3.580

318

-

$4.260

$3.810

$3.580

Distributors (In-Stock)

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Digiode

USA . 3,523 parts In-Stock

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$4.484

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$4.484

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Vyrian

USA . 761 parts In-Stock

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$4.720

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761

$4.720

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Component Electronics Inc.

Canada . 9 parts In-Stock

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$7.690

100+ parts

$5.770

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$5.000

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9

$7.690

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Chip Stock

USA . 13,900 parts In-Stock

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Flip Electronics

USA . 6,470 parts In-Stock

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Anansix

USA . 1,042 parts In-Stock

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Bristol Electronics

USA . 980 parts In-Stock

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Atlantic Semiconductor

USA . 980 parts In-Stock

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980

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Freddi Giovanni

Italy . 210 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 206 parts In-Stock

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Cyclops Electronics Ltd

UK . 80 parts In-Stock

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80

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Lantek

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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One Stop Electronics

USA . 3,130 parts In-Stock

1+ parts

$4.010

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3,130

$4.010

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Corphita

USA . 57 parts In-Stock

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$4.248

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57

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Perfect Parts

USA . 5,034 parts In-Stock

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5,034

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UNI Independent Distributors

Spain . 2,296 parts In-Stock

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Authorized Procurement Solutions

USA . 800 parts In-Stock

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800

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A-Z Elektronik GmbH

Germany . 750 parts In-Stock

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750

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Technical Specifications

Cellphone ICs MC13202FC attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

MC13202FC Telecommunications trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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