Loading...

ADC31RF80IRMP

Texas Instruments

ADC31RF80IRMP by Texas Instruments

Texas Instruments' ADC31RF80IRMP is a cellphone IC with 72 terminals in a square chip carrier package. Operating from -40 to 85°C, it features RF and baseband circuits, 1.15V supply voltage, and 1439mA max current draw. Ideal for telecom applications due to its compact size and industrial temperature grade suitability.

Median Price

$654.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,590 parts In-Stock

1+ parts

$654.240

100+ parts

$592.200

1k+ parts

$564.000

10k+ parts

-

1,590

$654.240

$592.200

$564.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,469 parts In-Stock

1+ parts

$621.528

100+ parts

-

1k+ parts

-

10k+ parts

-

1,469

$621.528

-

-

-

Vyrian

USA . 2,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,517

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 930 parts In-Stock

1+ parts

$1.722

100+ parts

-

1k+ parts

-

10k+ parts

-

930

$1.722

-

-

-

Northwest PG Solutions

USA . 884 parts In-Stock

1+ parts

$1.894

100+ parts

-

1k+ parts

-

10k+ parts

-

884

$1.894

-

-

-

Parana Technologies

USA . 538 parts In-Stock

1+ parts

$5.596

100+ parts

$519.703

1k+ parts

$5.037

10k+ parts

-

538

$5.596

$519.703

$5.037

-

DigiPath Technology Company

USA . 1,396 parts In-Stock

1+ parts

$6.162

100+ parts

-

1k+ parts

-

10k+ parts

-

1,396

$6.162

-

-

-

ChromeModa Solutions

Germany . 3,269 parts In-Stock

1+ parts

$6.288

100+ parts

$5.156

1k+ parts

-

10k+ parts

-

3,269

$6.288

$5.156

-

-

IDEA Electronic Components Group

UK . 1,205 parts In-Stock

1+ parts

$6.288

100+ parts

-

1k+ parts

$5.659

10k+ parts

-

1,205

$6.288

-

$5.659

-

AZTECH Wire

Italy . 759 parts In-Stock

1+ parts

$11.980

100+ parts

-

1k+ parts

-

10k+ parts

-

759

$11.980

-

-

-

Microchip USA

USA . 1,728 parts In-Stock

1+ parts

$511.830

100+ parts

$493.220

1k+ parts

$483.910

10k+ parts

$474.610

1,728

$511.830

$493.220

$483.910

$474.610

Corphita

USA . 4,025 parts In-Stock

1+ parts

$588.816

100+ parts

-

1k+ parts

-

10k+ parts

-

4,025

$588.816

-

-

-

Overview

Experience the cutting-edge technology of Texas Instruments with the ADC31RF80IRMP, a top-tier Cellphone IC that offers unparalleled quality and performance. As a leader in the industry, Texas Instruments ensures reliability and innovation in every product they create. The ADC31RF80IRMP provides seamless integration, high efficiency, and optimal functionality for various applications in the telecommunications field. Elevate your projects with this versatile and dependable component, designed to deliver value and benefits that exceed expectations. Trust Texas Instruments to deliver excellence with the ADC31RF80IRMP.

Feature Benefit Bullets

Surface Mount YES

Being surface mount compatible makes it easy to mount and integrate into electronic circuit boards, saving space and reducing assembly time.

Package Shape SQUARE

The square package shape offers efficient use of space on the circuit board, allowing for a compact and sleek design.

No. of Terminals 72

Having a high number of terminals provides versatility and compatibility with a wide range of electronic devices and systems.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers a combination of features including heat dissipation capabilities and a thin profile, making it suitable for high-performance applications.

Maximum Operating Temperature 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and ensure reliable performance.

Minimum Operating Temperature -40 °C

The low minimum operating temperature allows this product to operate effectively in a wide range of temperatures, making it suitable for various applications.

Terminal Finish NICKEL PALLADIUM GOLD

The terminal finish provides excellent connectivity and corrosion resistance, ensuring long-lasting performance and reliability.

Terminal Position QUAD

The quad terminal position offers enhanced stability and secure connections, improving overall performance and durability.

Maximum Seated Height 0.9 mm

The low maximum seated height allows for a compact and slim design, making it suitable for space-constrained applications.

Width 10 mm

The moderate width offers a balance between space efficiency and ease of handling during assembly and integration.

Maximum Time At Peak Reflow Temperature (s) 30

The short time at peak reflow temperature helps prevent thermal stress and damage during soldering, ensuring product reliability.

Peak Reflow Temperature °C 260

The high peak reflow temperature allows for robust soldering processes, ensuring strong and secure connections.

Length 10 mm

The moderate length contributes to the overall compact design of the product, making it suitable for applications where space is limited.

Temperature Grade INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making it suitable for a wide range of applications.

Terminal Form NO LEAD

The absence of lead in the terminal form makes this product environmentally friendly and compliant with industry regulations.

Maximum Supply Current 1439 mA

With a high maximum supply current, this product can support power-hungry applications and devices, ensuring stable and consistent performance.

Telecom IC Type RF AND BASEBAND CIRCUIT

The RF and baseband circuit type makes this product suitable for telecommunications applications, providing reliable signal processing and communication capabilities.

Nominal Supply Voltage 1.15 V

The nominal supply voltage offers compatibility with a wide range of electronic systems and devices, ensuring seamless integration and operation.

Terminal Pitch 0.5 mm

The small terminal pitch allows for high-density mounting and improves signal integrity, making it ideal for compact and high-performance applications.

Moisture Sensitivity Level (MSL) 3

With a moderate moisture sensitivity level, this product can withstand typical storage and handling conditions, ensuring product reliability and longevity.

Technical Specifications

Cellphone ICs ADC31RF80IRMP attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Current:

1439 mA

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

ADC31RF80IRMP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 1