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TCM320AC56DWR

Texas Instruments

TCM320AC56DWR by Texas Instruments

TCM320AC56DWR by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features Gull Wing terminal form, 5V supply voltage, and is used in Baseband Circuit for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,589 parts In-Stock

1+ parts

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2,589

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Digiode

USA . 435 parts In-Stock

1+ parts

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435

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 190 parts In-Stock

1+ parts

$14.768

100+ parts

-

1k+ parts

$15.206

10k+ parts

-

190

$14.768

-

$15.206

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ChromeModa Solutions

Germany . 6,485 parts In-Stock

1+ parts

$16.593

100+ parts

$13.606

1k+ parts

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10k+ parts

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6,485

$16.593

$13.606

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IDEA Electronic Components Group

UK . 1,288 parts In-Stock

1+ parts

$16.593

100+ parts

$15.763

1k+ parts

$14.934

10k+ parts

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1,288

$16.593

$15.763

$14.934

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AZTECH Wire

Italy . 297 parts In-Stock

1+ parts

$17.574

100+ parts

-

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297

$17.574

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One Stop Electronics

USA . 359 parts In-Stock

1+ parts

$231.000

100+ parts

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359

$231.000

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Corphita

USA . 3,798 parts In-Stock

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3,798

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DigiPath Technology Company

USA . 1,314 parts In-Stock

1+ parts

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100+ parts

$14.960

1k+ parts

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1,314

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$14.960

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Overview

Enhance the performance and efficiency of your cellphone with the TCM320AC56DWR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Cellphone ICs that provide seamless connectivity and enhanced functionality. With a focus on innovation and excellence, this product offers customers unmatched value, delivering outstanding performance and durability. Whether you're looking to improve call clarity or optimize data transfer, the TCM320AC56DWR is the perfect choice for all your cellphone IC needs. Upgrade your device today and experience the difference that Texas Instruments can make in your daily communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mounting allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape offers a compact design, enabling efficient use of space on the circuit board.

No. of Terminals: 20

With a sufficient number of terminals, this product can accommodate multiple connections and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint on the board, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand heat-intensive environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positioning provides stability and secure connections, reducing the risk of disconnection or failure.

Maximum Seated Height: 2.65 mm

The low seated height facilitates a slim profile for the product, contributing to space-saving designs.

Width: 7.5 mm

The compact width dimension allows for easy integration into various electronic devices or systems.

Length: 12.8 mm

The moderate length measurement offers a balanced form factor, suitable for a wide range of applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operations, this product can meet the robust performance requirements of industrial applications.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering during the assembly process.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit type, this product is essential for processing and managing telecommunications signals efficiently.

Nominal Supply Voltage: 5 V

Operating at a standard nominal supply voltage of 5V, this product ensures compatibility with various electronic systems and power sources.

Terminal Pitch: 1.27 mm

With a precise terminal pitch measurement, this product is suitable for high-density mounting applications, offering enhanced connectivity.

Technical Specifications

Cellphone ICs TCM320AC56DWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM320AC56DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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