Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLV321AC37CDW by Texas Instruments is a 20-terminal cellphone IC in small outline package. Operating temp range: 0-70°C, supply voltage: 3V. Ideal for baseband circuits due to CMOS technology and gull wing terminal form.
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$15.837
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IDEA Electronic Components Group
$15.045
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AZTECH Wire
$15.879
Ampacity Inc.
$186.000
Semicontronic
$286.000
$278.850
$277.420
One Stop Electronics
$697.000
Corphita
DigiPath Technology Company
$14.279
Corohmni
This material is durable and lightweight, making the cellphone ICs easy to handle and less prone to damage during assembly and usage.
Surface mount technology allows for easy and efficient assembly of the ICs onto circuit boards, resulting in a more streamlined manufacturing process.
The rectangular shape of the package provides a standardized form factor that is compatible with a wide range of devices and makes it easy to integrate the ICs into various electronic systems.
Having a sufficient number of terminals allows for the ICs to connect to multiple components within a circuit, enabling versatile functionality and connectivity options.
The small outline package style helps in conserving space on the circuit board, making it suitable for compact electronic devices where size is a critical factor.
With a high maximum operating temperature, the ICs can withstand elevated temperatures during operation, ensuring reliable performance even in demanding environments.
The low minimum operating temperature range allows the ICs to function effectively in colder environments without any performance issues, offering versatility in usage.
The dual terminal position provides redundancy and improves signal integrity, enhancing the overall reliability of the ICs in complex circuitry.
With a low maximum seated height, the ICs can be easily accommodated in slim devices without compromising on performance or functionality.
The compact width of the ICs allows for efficient placement on the circuit board, optimizing space utilization and facilitating a streamlined design.
The moderate length of the ICs strikes a balance between space-saving and functionality, making them suitable for a wide range of electronic applications.
Designed for commercial use, these ICs offer reliable performance in standard operating conditions, making them a cost-effective choice for mass-produced consumer electronics.
Complementary Metal-Oxide-Semiconductor (CMOS) technology enables low power consumption and high-speed operation, enhancing the energy efficiency and performance of the ICs.
The gull wing terminal form provides a secure connection and facilitates easy soldering onto the circuit board, ensuring robust electrical contact and reliable performance.
As a baseband circuit, these ICs handle essential functions such as signal processing and data transmission in telecommunication systems, making them a vital component for communication devices.
Operating at a nominal supply voltage of 3V, these ICs offer compatibility with standard power sources and ensure stable performance in various electronic devices.
The precise terminal pitch of 1.27mm allows for easy alignment and secure mounting of the ICs on the circuit board, facilitating efficient assembly and reliable electrical connections.
Cellphone ICs TLV321AC37CDW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
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TLV321AC37CDW Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
Laube Technology
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
BAV99
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Diotec Semiconductor Ag
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
LM358N
Silicon Group
TRF3701IRHCRG4
TRF3701IRHCRG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, measures 4x4mm in size, and is surface mountable.
HMC696LP4ETR
Analog Devices
HMC696LP4ETR by Analog Devices is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a supply voltage of 5V and max current of 0.18mA. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.
SARA-R422-01B
U-blox Ag
RF AND BASEBAND CIRCUIT;
NRF9160-SICA-B1A-R7
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SICA-B1A-R7 is a surface-mount Cellphone IC with 127 terminals in a rectangular grid array package. It operates b/w -40°C to 85°C, suitable for industrial applications. This RF and baseband circuit has a nominal voltage of 3.8V, making it ideal for telecom devices.
TCM320AC56CPT
TCM320AC56CPT by Texas Instruments is a cellphone IC with 48 terminals, operating at 0-70°C. It features a 13-bit linear coding, μ-law companding law, and operates on a 5V supply voltage. This baseband circuit IC has a low profile flatpack package suitable for telecom applications.
LMV228TL
LMV228TL by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has 4 terminals with 0.5mm pitch and a compact square shape measuring 1.014mm x 1.014mm.
CC2510F8RSPR
CC2510F8RSPR by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.5/3.3V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size (6x6mm).
HMC422MS8E
Analog Devices' HMC422MS8E is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C and has a terminal pitch of 0.65mm. Ideal for RF and baseband circuits in telecom applications due to its matte tin finish and dual terminal position.
CC2400-RTB1
CC2400-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and low supply current of 0.005mA. Ideal for telecom applications due to its compact square package shape and CMOS technology.
CC2511F16RSPR
The Texas Instruments CC2511F16RSPR is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures from 0 to 85°C, with a supply voltage of 3.3V. This RF and baseband circuit features CMOS technology and has a terminal pitch of 0.5mm, making it suitable for various wireless communication applications.
ADL5502ACBZ-P7
ADL5502ACBZ-P7 by Analog Devices is a CELLPHONE IC with BICMOS tech. Features include 3V supply, -40 to 85°C temp range, and RF/BASEBAND circuit type. Its GRID ARRAY package has 8 terminals, 0.5mm pitch, and measures 1.46mm in length/width for telecom applications.
TLV320AC57IPT
TLV320AC57IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage, operating from -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a low-profile flatpack with gull wing terminals, suitable for industrial temperature grades.
CC1000_UCSP/T&R
CC1000_UCSP/T&R by Texas Instruments is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V and uses CMOS technology for RF and baseband circuits. This rectangular package with grid array style is ideal for telecom applications requiring compact design and high performance in industrial temperature environments.
ADL5363ACPZ-R7
ADL5363ACPZ-R7 by Analog Devices is a cellphone IC with BICMOS technology, operating b/w -40 to 85°C. It features 20 terminals in a square chip carrier package style, suitable for RF and baseband circuits. With a nominal voltage of 5V, it is ideal for industrial telecom applications.
AD9361BBCZ-CSL
AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.
HMC381LP6E
Analog Devices' HMC381LP6E is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, matte tin finish, and a nominal voltage of 5V.
TCM320AC56N
TCM320AC56N by Texas Instruments is a BASEBAND CIRCUIT for cellphones. It operates b/w -40 to 85°C with 5V supply voltage. The IC has 20 terminals in an IN-LINE package measuring 7.62mm x 24.325mm x 5.08mm (WxLxH).
LMV225TLX
Texas Instruments LMV225TLX is a cellphone IC with 4 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
TRF6901PTR
TRF6901PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with supply voltage of 2/3.3V and current draw of 0.04mA. Ideal for RF and baseband circuits in telecom applications due to its low profile design and fine pitch style.
TLV320AC56CPT
TLV320AC56CPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage. It features a 13-bit linear coding, mu-law companding law, and filter for baseband circuits. This CMOS technology IC operates b/w 0-70°C and has low profile flatpack packaging suitable for telecom applications.
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TLV320AC57IDW
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
TLV320AC56N
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
TLV320AC56DW
TLV320AC57DW
TLV320AC57CDW
BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
TLV320AC56IN
TLV320AC57IDWR
TLV320AC56CDWR
TLV320AC56PT
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
TLV320AC56DWR
TLV320AC57CPT
BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
TLV320AC57CDWR
TLV320AC56IDWR
TLV320AC57DWR
TLV320AC56IPT
TLV320AC56CDW
TLV320AC56CN
BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
TLV320AC56IDW
TLV320AC57CN
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