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TCM320AC57CDW

Texas Instruments

TCM320AC57CDW by Texas Instruments

TCM320AC57CDW by Texas Instruments is a 20-terminal cellphone IC with A-LAW companding law, 13-bit linear coding, and a 5V supply voltage. It is designed for baseband circuit applications in telecom devices, featuring a small outline package style and gull wing terminal form for surface mount assembly. Operating temperature ranges from 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,247 parts In-Stock

1+ parts

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7,247

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Digiode

USA . 72 parts In-Stock

1+ parts

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$8.458

100+ parts

-

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190

$8.458

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Parana Technologies

USA . 467 parts In-Stock

1+ parts

$12.672

100+ parts

-

1k+ parts

$13.136

10k+ parts

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467

$12.672

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$13.136

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ChromeModa Solutions

Germany . 3,902 parts In-Stock

1+ parts

$14.238

100+ parts

$11.675

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-

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3,902

$14.238

$11.675

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IDEA Electronic Components Group

UK . 907 parts In-Stock

1+ parts

$14.238

100+ parts

$13.526

1k+ parts

$12.814

10k+ parts

-

907

$14.238

$13.526

$12.814

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One Stop Electronics

USA . 166 parts In-Stock

1+ parts

$811.000

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166

$811.000

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Corphita

USA . 3,086 parts In-Stock

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3,086

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DigiPath Technology Company

USA . 1,465 parts In-Stock

1+ parts

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100+ parts

$12.837

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1,465

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$12.837

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Overview

Unlock the potential of your cellphone with the TCM320AC57CDW by Texas Instruments. Manufactured by a trusted leader in the industry, this high-quality Cellphone IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this compact and efficient component provides exceptional value to customers seeking seamless communication solutions. Experience the benefits of cutting-edge technology and superior design with the TCM320AC57CDW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing production costs.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of devices and power sources.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperatures without malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient and reliable performance.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC, this product is specifically designed for handling signal processing tasks in telecommunications applications.

Technical Specifications

Cellphone ICs TCM320AC57CDW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0099 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM320AC57CDW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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