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LMH9226IRRLR

Texas Instruments

LMH9226IRRLR by Texas Instruments

LMH9226IRRLR by Texas Instruments is a Cellphone IC with 12 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for cellphone applications.

Median Price

$2.468

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,490 parts In-Stock

1+ parts

$2.115

100+ parts

$1.853

1k+ parts

$1.047

10k+ parts

-

29,490

$2.115

$1.853

$1.047

-

DigiKey

USA . 2,912 parts In-Stock

1+ parts

$2.820

100+ parts

$1.730

1k+ parts

$1.533

10k+ parts

$1.405

2,912

$2.820

$1.730

$1.533

$1.405

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,761 parts In-Stock

1+ parts

$2.009

100+ parts

-

1k+ parts

-

10k+ parts

-

1,761

$2.009

-

-

-

Vyrian

USA . 2,317 parts In-Stock

1+ parts

$2.115

100+ parts

-

1k+ parts

-

10k+ parts

-

2,317

$2.115

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,985 parts In-Stock

1+ parts

$1.904

100+ parts

-

1k+ parts

-

10k+ parts

-

4,985

$1.904

-

-

-

Parana Technologies

USA . 631 parts In-Stock

1+ parts

$8.116

100+ parts

-

1k+ parts

$8.711

10k+ parts

-

631

$8.116

-

$8.711

-

ChromeModa Solutions

Germany . 5,112 parts In-Stock

1+ parts

$9.119

100+ parts

$7.478

1k+ parts

-

10k+ parts

-

5,112

$9.119

$7.478

-

-

IDEA Electronic Components Group

UK . 2,021 parts In-Stock

1+ parts

$9.119

100+ parts

$8.663

1k+ parts

$8.207

10k+ parts

-

2,021

$9.119

$8.663

$8.207

-

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$10.876

100+ parts

$9.897

1k+ parts

$8.918

10k+ parts

-

270

$10.876

$9.897

$8.918

-

Lixinc

USA . 8,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,048

-

-

-

-

DigiPath Technology Company

USA . 1,781 parts In-Stock

1+ parts

-

100+ parts

$8.222

1k+ parts

-

10k+ parts

-

1,781

-

$8.222

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Texas Instruments with the LMH9226IRRLR, a cutting-edge Cellphone IC that is revolutionizing the telecommunications industry. With a focus on innovation and precision engineering, Texas Instruments delivers top-of-the-line products that exceed expectations. The LMH9226IRRLR offers customers unmatched value, providing seamless integration, optimal performance, and enhanced functionality for a wide range of applications. Stay ahead of the competition and elevate your projects with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties and durability, making the product resistant to damage and wear.

Surface Mount: YES

Surface mount technology allows for efficient and compact placement of the IC on a circuit board, saving space and enabling automated assembly.

No. of Terminals: 12

Having 12 terminals provides sufficient connectivity options for interfacing with other components, ensuring versatility in usage.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the IC can withstand demanding environmental conditions and maintain stable performance.

Nominal Supply Voltage: 3.3 V

Operating at a standard supply voltage of 3.3 V, the IC can be easily integrated into existing systems without requiring additional power sources.

Technical Specifications

Cellphone ICs LMH9226IRRLR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.08SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

100 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

LMH9226IRRLR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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