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LMH9126IRRLR

Texas Instruments

LMH9126IRRLR by Texas Instruments

Texas Instruments LMH9126IRRLR is a cellphone IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It features RF and baseband circuits, operates at 3.3V, and has moisture sensitivity level of 2.

Median Price

$3.492

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 56,306 parts In-Stock

1+ parts

$2.404

100+ parts

$2.106

1k+ parts

$1.190

10k+ parts

-

56,306

$2.404

$2.106

$1.190

-

Mouser Electronics

USA . 2,954 parts In-Stock

1+ parts

$4.580

100+ parts

$2.350

1k+ parts

$1.700

10k+ parts

$1.620

2,954

$4.580

$2.350

$1.700

$1.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,890 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

4,890

$1.520

-

-

-

Digiode

USA . 4,673 parts In-Stock

1+ parts

$2.284

100+ parts

-

1k+ parts

-

10k+ parts

-

4,673

$2.284

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 29,601 parts In-Stock

1+ parts

$1.290

100+ parts

$1.258

1k+ parts

$1.251

10k+ parts

-

29,601

$1.290

$1.258

$1.251

-

Corohmni

South Africa . 419 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

419

$1.520

-

-

-

Corphita

USA . 1,406 parts In-Stock

1+ parts

$2.164

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

$2.164

-

-

-

Component Stockers USA

USA . 2,081 parts In-Stock

1+ parts

$3.080

100+ parts

$2.270

1k+ parts

$1.630

10k+ parts

-

2,081

$3.080

$2.270

$1.630

-

Parana Technologies

USA . 2,142 parts In-Stock

1+ parts

$13.291

100+ parts

-

1k+ parts

$13.797

10k+ parts

-

2,142

$13.291

-

$13.797

-

DigiPath Technology Company

USA . 2,113 parts In-Stock

1+ parts

$14.635

100+ parts

-

1k+ parts

-

10k+ parts

-

2,113

$14.635

-

-

-

ChromeModa Solutions

Germany . 5,889 parts In-Stock

1+ parts

$14.934

100+ parts

$12.246

1k+ parts

-

10k+ parts

-

5,889

$14.934

$12.246

-

-

IDEA Electronic Components Group

UK . 2,100 parts In-Stock

1+ parts

$14.934

100+ parts

$14.187

1k+ parts

$13.441

10k+ parts

-

2,100

$14.934

$14.187

$13.441

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Get ready to revolutionize your cellphone's performance with the LMH9126IRRLR by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers cutting-edge Cellphone ICs that set new standards in the industry. This versatile chip carrier offers unparalleled reliability and efficiency, ensuring smooth operation even under extreme conditions. Upgrade your device with this RF and Baseband Circuit, designed for maximum functionality and durability. Experience the difference with Texas Instruments' LMH9126IRRLR - the ultimate solution for all your cellphone needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is lightweight, durable, and cost-effective, making it a popular choice for electronic components such as cellphone ICs.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto the circuit board, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, enabling higher component density and potentially reducing overall size of the device.

No. of Terminals: 12

Having 12 terminals provides the necessary connectivity for the IC to interface with other components in the circuit, allowing for versatile functionality.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple metals for terminal finish ensures good conductivity, corrosion resistance, and improved solderability, enhancing the reliability and longevity of the IC.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the IC can withstand high temperature environments without compromising performance, offering robust operation in various conditions.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, the IC is compatible with standard power sources, ensuring interoperability with existing systems and reducing the need for additional voltage regulation.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the IC is moderately sensitive to moisture, requiring proper handling and storage to prevent damage during assembly and operation, ensuring product reliability.

Technical Specifications

Cellphone ICs LMH9126IRRLR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N12

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LMH9126IRRLR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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