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TLV320AC57PT

Texas Instruments

TLV320AC57PT by Texas Instruments

TLV320AC57PT by Texas Instruments is a 48-terminal cellphone IC with a 3V supply voltage. It operates b/w -40°C to 85°C, making it suitable for industrial applications. The package style is flatpack, low profile, fine pitch, ideal for telecom baseband circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,683 parts In-Stock

1+ parts

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4,683

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Vyrian

USA . 3,414 parts In-Stock

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3,414

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 522 parts In-Stock

1+ parts

$7.535

100+ parts

-

1k+ parts

$8.044

10k+ parts

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522

$7.535

-

$8.044

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DigiPath Technology Company

USA . 909 parts In-Stock

1+ parts

$8.297

100+ parts

$7.633

1k+ parts

-

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909

$8.297

$7.633

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IDEA Electronic Components Group

UK . 1,553 parts In-Stock

1+ parts

$8.466

100+ parts

$8.043

1k+ parts

$7.619

10k+ parts

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1,553

$8.466

$8.043

$7.619

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ChromeModa Solutions

Germany . 430 parts In-Stock

1+ parts

$8.466

100+ parts

$6.942

1k+ parts

-

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430

$8.466

$6.942

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AZTECH Wire

Italy . 303 parts In-Stock

1+ parts

$12.196

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303

$12.196

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One Stop Electronics

USA . 744 parts In-Stock

1+ parts

$653.000

100+ parts

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744

$653.000

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Corphita

USA . 1,034 parts In-Stock

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1,034

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Overview

Enhance the performance of your cellphone with the TLV320AC57PT by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers cutting-edge Cellphone ICs that deliver superior sound quality and optimized functionality. This advanced IC is designed to elevate your mobile experience, providing crystal-clear audio and seamless communication. Upgrade your device today with the TLV320AC57PT and enjoy the benefits of Texas Instruments' innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making this IC suitable for mobile phones that require a compact and sturdy design.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, making the integration of this IC seamless and cost-effective.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB, allowing for more components to be placed in a limited area, enhancing the functionality of the cellphone.

No. of Terminals: 48

With 48 terminals, this IC offers a wide range of connectivity options, enabling it to handle various functions within the cellphone efficiently.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high heat conditions, ensuring reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows this IC to function in cold environments without compromising its performance, making it versatile for use in different climates.

Terminal Position: QUAD

The quad terminal position ensures secure connections and stable performance, making this IC suitable for applications where reliability is crucial, such as in cellphone baseband circuits.

Maximum Seated Height: 1.6 mm

With a low profile and maximum seated height of 1.6 mm, this IC can be integrated into slim and compact cellphone designs, enhancing the overall aesthetics of the device.

Width: 7 mm

The 7 mm width allows for easy placement and routing on the PCB, contributing to efficient assembly and optimal use of space within the cellphone.

Length: 7 mm

The 7 mm length of the IC helps in maintaining a balanced and symmetrical layout on the PCB, ensuring uniform distribution of components for improved functionality.

Temperature Grade: INDUSTRIAL

Being industrial-grade, this IC is designed to operate reliably in harsh environments with fluctuating temperatures, making it suitable for use in rugged cellphone applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder connections and easy installation, ensuring robust electrical connections for the baseband circuit of the cellphone.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit IC, this product plays a critical role in processing communication signals within the cellphone, making it an essential component for ensuring reliable call quality and data transmission.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3 V, this IC is optimized for power efficiency, helping to prolong the battery life of the cellphone and enhance overall energy performance.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables high-density mounting on the PCB, allowing for more connectivity options and advanced features within the cellphone architecture.

Technical Specifications

Cellphone ICs TLV320AC57PT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLV320AC57PT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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