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TCM320AC57CDWR

Texas Instruments

TCM320AC57CDWR by Texas Instruments

Texas Instruments TCM320AC57CDWR is a cellphone IC with 20 terminals in a small outline package. Operating temperature range from 0 to 70°C, CMOS technology, and nominal voltage of 5V make it ideal for baseband circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,223 parts In-Stock

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5,223

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Digiode

USA . 4,942 parts In-Stock

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4,942

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Distributors (Availability)

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$7.707

100+ parts

-

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660

$7.707

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Parana Technologies

USA . 969 parts In-Stock

1+ parts

$8.380

100+ parts

$778.232

1k+ parts

$7.542

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969

$8.380

$778.232

$7.542

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DigiPath Technology Company

USA . 961 parts In-Stock

1+ parts

$9.228

100+ parts

$8.489

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961

$9.228

$8.489

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ChromeModa Solutions

Germany . 4,058 parts In-Stock

1+ parts

$9.416

100+ parts

$7.721

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4,058

$9.416

$7.721

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IDEA Electronic Components Group

UK . 1,136 parts In-Stock

1+ parts

$9.416

100+ parts

$8.945

1k+ parts

$8.474

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1,136

$9.416

$8.945

$8.474

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One Stop Electronics

USA . 460 parts In-Stock

1+ parts

$973.000

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460

$973.000

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Corphita

USA . 232 parts In-Stock

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232

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Overview

Experience seamless connectivity and superior performance with the TCM320AC57CDWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in every product they produce. This cellphone IC is designed for optimal functionality and efficiency, making it perfect for a wide range of applications. Whether you're looking to enhance your smartphone's performance or streamline your communication devices, this innovative product offers unmatched value and benefits to customers looking for cutting-edge solutions. Trust Texas Instruments to deliver excellence in technology with the TCM320AC57CDWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for mobile phone applications.

Surface Mount: YES

Being surface mountable makes assembly easier and more efficient, saving time and costs in the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, maximizing component density and integration.

No. of Terminals: 20

Having 20 terminals provides multiple connection points for various functions and interfaces, increasing the versatility of the IC.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-saving and compact, making it suitable for smaller devices like cellphones.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the IC can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliability even in colder environments, making the IC versatile in various usage scenarios.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and layout, allowing for different connection configurations.

Maximum Seated Height: 2.65 mm

The low seated height makes the IC suitable for slim and compact device designs, without adding unnecessary bulk.

Width: 7.5 mm

The compact width enables efficient space utilization on the circuit board, contributing to a more streamlined and integrated design.

Length: 12.8 mm

The moderate length provides a balance between compactness and functionality, making it suitable for mobile phone applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable and reliable performance in standard operating conditions, meeting the requirements of most consumer electronics.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it energy-efficient and responsive for cellphone applications.

Terminal Form: GULL WING

The gull wing terminal form is suitable for surface mounting, enhancing solder joint reliability and overall product longevity.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit IC, it is responsible for processing and managing communication signals, essential for cellphone functionality.

Nominal Supply Voltage: 5 V

The 5V supply voltage is commonly used in electronics, providing compatibility and ease of integration with existing systems.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for precise connection and high-density mounting, enabling efficient use of space on the circuit board.

Technical Specifications

Cellphone ICs TCM320AC57CDWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM320AC57CDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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