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TCM320AC57DW

Texas Instruments

TCM320AC57DW by Texas Instruments

Texas Instruments TCM320AC57DW is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features GULL WING terminals, 5V supply voltage, and is ideal for BASEBAND CIRCUIT applications in the telecom industry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,970 parts In-Stock

1+ parts

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3,970

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Digiode

USA . 1,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,395

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,921 parts In-Stock

1+ parts

$8.732

100+ parts

-

1k+ parts

$9.413

10k+ parts

-

1,921

$8.732

-

$9.413

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ChromeModa Solutions

Germany . 2,357 parts In-Stock

1+ parts

$9.811

100+ parts

$8.045

1k+ parts

-

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2,357

$9.811

$8.045

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IDEA Electronic Components Group

UK . 1,219 parts In-Stock

1+ parts

$9.811

100+ parts

$9.320

1k+ parts

$8.830

10k+ parts

-

1,219

$9.811

$9.320

$8.830

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AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$17.516

100+ parts

-

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568

$17.516

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One Stop Electronics

USA . 1,270 parts In-Stock

1+ parts

$622.000

100+ parts

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1,270

$622.000

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DigiPath Technology Company

USA . 1,331 parts In-Stock

1+ parts

-

100+ parts

$8.846

1k+ parts

-

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1,331

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$8.846

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Corphita

USA . 473 parts In-Stock

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473

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Overview

Unlock the power of seamless communication with the TCM320AC57DW by Texas Instruments, a cutting-edge cellphone IC that sets new standards for performance and reliability. Crafted by the industry leader in semiconductor technology, this innovative component boasts a durable plastic package body and convenient surface mount design. Ideal for various telecom applications, this baseband circuit offers unparalleled value with its wide operating temperature range, superior quality, and compact size. Elevate your products to the next level with the TCM320AC57DW and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the product.

Surface Mount: YES

The surface mount feature makes it easier to integrate this cell phone IC into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on circuit boards and helps in optimizing space utilization.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting the IC with other components, enabling a wide range of functionalities.

Package Style: SMALL OUTLINE

The small outline package style ensures compatibility with modern compact devices and helps in reducing overall PCB footprint.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding operating conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and enhances connectivity, making the IC more reliable in critical applications.

Maximum Seated Height: 2.65 mm

The compact maximum seated height allows for easy integration in slim devices without compromising on functionality.

Width: 7.5 mm

The narrow width makes this IC suitable for space-constrained designs, enabling versatile applications in various cell phone models.

Length: 12.8 mm

The moderate length of 12.8 mm strikes a balance between compactness and functionality, making it a versatile choice for cell phone applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliability and stability of the IC in harsh operating environments, making it suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and improves mechanical strength, enhancing the overall durability of the IC.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit type, this IC is specifically designed for telecom applications, offering high performance and efficiency in cell phone communication.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this IC is compatible with standard power sources, ensuring easy integration into existing cell phone circuits.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise connection and easy soldering, enhancing the overall reliability of the IC in cell phone applications.

Technical Specifications

Cellphone ICs TCM320AC57DW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM320AC57DW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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