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HMC818LP4ETR

Analog Devices

HMC818LP4ETR by Analog Devices

Analog Devices' HMC818LP4ETR is a 24-terminal cellphone IC in a square chip carrier package with very thin profile. It operates b/w -40 °C to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at 3V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 500 parts In-Stock

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500

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Distributors (In-Stock)

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Vyrian

USA . 5,350 parts In-Stock

1+ parts

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5,350

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Digiode

USA . 249 parts In-Stock

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249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 643 parts In-Stock

1+ parts

$15.868

100+ parts

-

1k+ parts

$14.757

10k+ parts

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643

$15.868

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$14.757

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IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$17.062

100+ parts

$16.209

1k+ parts

$16.209

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637

$17.062

$16.209

$16.209

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DigiPath Technology Company

USA . 80 parts In-Stock

1+ parts

$26.617

100+ parts

$25.552

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$25.552

80

$26.617

$25.552

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$25.552

Semicontronic

India . 208 parts In-Stock

1+ parts

$505.000

100+ parts

$492.375

1k+ parts

$489.850

10k+ parts

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208

$505.000

$492.375

$489.850

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Corphita

USA . 977 parts In-Stock

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977

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Overview

Discover the cutting-edge HMC818LP4ETR by Analog Devices, a top-tier manufacturer in the industry of Cellphone ICs. This innovative product boasts a sleek package style, surface mount capability, and high-quality construction with plastic/epoxy material. Ideal for RF and baseband circuit applications, this Telecom IC offers exceptional performance in a compact design. Elevate your projects with Analog Devices' HMC818LP4ETR, providing reliability, efficiency, and advanced technology to meet all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for long term use.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation of the product onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, which is ideal for devices where size is a critical factor.

No. of Terminals: 24

With 24 terminals, this product offers a wide range of connectivity options and flexibility for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without any performance issues.

Terminal Position: QUAD

The quad terminal position enhances the connectivity and stability of the product, ensuring seamless integration into the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for slim and compact devices.

Width: 4 mm

The compact width of 4mm allows for a space-efficient design that can easily fit into various electronic devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure soldering and excellent thermal performance during the manufacturing process.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh operating conditions and industrial environments.

Nominal Supply Voltage: 3 V

The 3V supply voltage is commonly used in many electronic devices, providing compatibility and versatility for a wide range of applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and improved signal integrity, making it suitable for advanced electronic devices.

Technical Specifications

Cellphone ICs HMC818LP4ETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC818LP4ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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