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HMC832LP6GE

Analog Devices

HMC832LP6GE by Analog Devices

Analog Devices' HMC832LP6GE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating from -40 to 85°C, it's ideal for RF and baseband circuits, featuring a nominal voltage of 3.3V. With a very thin profile and terminal pitch of 0.5mm, this industrial-grade IC suits compact telecom applications.

Median Price

$16.852

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

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$16.690

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$16.690

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Digiode

USA . 181 parts In-Stock

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$17.014

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

USA . 6,113 parts In-Stock

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Sensible Micro Corp

USA . 1,280 parts In-Stock

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Cyclops Electronics Ltd

UK . 320 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Parana Technologies

USA . 1,845 parts In-Stock

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$6.377

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$5.931

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$6.377

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IDEA Electronic Components Group

UK . 1,527 parts In-Stock

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$6.857

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$6.514

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Aztec Data Supply Inc.

USA . 2,032 parts In-Stock

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$9.021

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$9.021

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DigiPath Technology Company

USA . 2,259 parts In-Stock

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$10.697

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$10.269

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AZTECH Wire

Italy . 831 parts In-Stock

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$11.716

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$15.220

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Semicontronic

India . 1 parts In-Stock

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$15.220

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$14.840

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$14.763

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$15.220

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Corphita

USA . 382 parts In-Stock

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$16.119

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Continental Prestige Electronics

USA . 4,599 parts In-Stock

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$16.690

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$16.356

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Netroflash

USA . 2,000 parts In-Stock

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$16.690

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Advanced Electronics

New Zealand . 750 parts In-Stock

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$17.024

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$17.024

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$17.024

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Corohmni

South Africa . 1,207 parts In-Stock

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$21.180

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Vigor

Singapore . 231 parts In-Stock

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$22.380

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Lixinc

USA . 6,793 parts In-Stock

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RC Electronics

USA . 4,500 parts In-Stock

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$16.820

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$15.860

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$15.540

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Argo Parts USA

USA . 3,542 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Perfect Parts

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Overview

Enhance your cellphone's performance with the HMC832LP6GE by Analog Devices. Crafted with precision and expertise, this high-quality Cellphone ICs offers unparalleled reliability and efficiency. From RF to baseband circuits, this versatile component caters to a wide range of applications, ensuring seamless connectivity and optimal functionality. With Analog Devices leading the way in innovation, you can trust that this product delivers superior value, benefits, and advantages to meet your every need. Elevate your mobile experience with the HMC832LP6GE today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the Cellphone IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

Square package shape enables compact and space-efficient design of the Cellphone IC, suitable for modern handheld devices.

No. of Terminals: 40

Having 40 terminals allows for sufficient connectivity options and functionalities within the Cellphone IC, enhancing its performance.

Maximum Operating Temperature: 85 °C

Operates effectively at temperatures up to 85°C, ensuring reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning at temperatures as low as -40°C, making it suitable for use in various environments and climates.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides excellent conductivity and solderability, ensuring stable connections for optimal functionality.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of signals and power, enhancing the overall performance and reliability of the Cellphone IC.

Maximum Seated Height: 0.9 mm

Low seated height of 0.9mm enables a slim and compact design of the Cellphone IC, ideal for space-constrained applications.

Width: 6 mm

Narrow width of 6mm facilitates easy integration of the Cellphone IC into various electronic devices, offering versatility in design.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the Cellphone IC can withstand high-temperature soldering processes without compromising its functionality.

Length: 6 mm

Compact length of 6mm ensures a space-saving layout of the Cellphone IC on the PCB, optimizing the overall board design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating guarantees reliable performance and durability of the Cellphone IC in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, making the Cellphone IC a sustainable choice for electronic devices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and Baseband circuits allows for seamless wireless communication and data processing within the Cellphone IC, enhancing connectivity and performance.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V, ensuring compatibility with standard power sources and efficient power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and enhances signal integrity, resulting in improved overall performance of the Cellphone IC.

Technical Specifications

Cellphone ICs HMC832LP6GE attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC832LP6GE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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