Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
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Cellphone ICs MC13751FCR2 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors
JESD-30 Code:
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NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
1N4148WT
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
Sangdest Microelectronics (Nanjing)
CRCW080510R0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510R0FKEA is a fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V. Operating temperature range from -55 to 155 °C ensures reliability in various environments.
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
First Components International
Semitron
TRF5901PTR
Texas Instruments
TRF5901PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, consuming 0.053mA at 3V supply voltage. This RF and baseband circuit has a low profile flatpack design for industrial telecom applications.
HMC6000LP711E
Analog Devices
Analog Devices' HMC6000LP711E is a cellphone IC with 60 terminals in a rectangular chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
TRF4400PWG4
TRF4400PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
AD7001AS
AD7001AS by Analog Devices is a Cellphone IC with 44 terminals in a square flatpack package. Operating temperature ranges from -25 to 85°C, suitable for baseband circuit applications. Technology used is CMOS with nominal voltage of 5V and terminal pitch of 0.8mm.
AFE8030EDIALK
AFE8030EDIALK by Texas Instruments is a Cellphone IC with 400 terminals in a square package. It operates b/w -40 to 85°C, with peak reflow temp of 220°C. This RF and baseband circuit is ideal for telecom applications due to its fine pitch grid array style and bottom terminal position.
BALF-NRG-02D3
STMicroelectronics
BALF-NRG-02D3 by STMicroelectronics is a CELLPHONE IC with 4 terminals, PLASTIC/EPOXY body, and TIN SILVER COPPER finish. It features a GRID ARRAY package style, -40 to 105 °C operating temp range, and RF AND BASEBAND CIRCUIT for telecom applications.
LE910C1EU06T060100
Telit Communications Plc
Telit LE910C1EU06T060100 is a CELL IC with 181 terminals, MICROELECTRONIC ASSEMBLY package style, and RF/BASEBAND CIRCUIT type. Operating from -40 to 85°C, it's ideal for telecom applications requiring a 3.8V supply voltage in compact designs with dimensions of 28.2mm x 28.2mm x 2.2mm.
HMC421QS16ETR
Analog Devices' HMC421QS16ETR is a 16-terminal cellphone IC in small outline package with matte tin finish. It operates b/w -40 °C to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits. With shrink pitch design, it has a compact size of 4.9mm x 3.9mm x 1.75mm for space-constrained designs.
ST25R3912-AWLT
ST25R3912-AWLT by STMicroelectronics is a CELLPHONE IC with 30 terminals in a GRID ARRAY package. It operates b/w -40 to 125°C, suitable for AUTOMOTIVE applications. This RF and BASEBAND CIRCUIT has a nominal voltage of 3.3V, making it ideal for telecom use.
MC13142D
Freescale Semiconductor
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
SARA-R500S-00B
U-blox Ag
RF AND BASEBAND CIRCUIT;
MAX2306ETI+
Analog Devices' MAX2306ETI+ is a cellphone IC with 28 terminals in a square chip carrier package. It operates at -40 to 85°C, with power supplies of 3/3.3V and a max supply current of 0.0415mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grade applications.
LMV228UR/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER;
MAX2029ETP+
MAX2029ETP+ by Analog Devices is a BICMOS technology Cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. Features include 5V supply voltage, peak reflow temp of 260°C, and 0.65mm terminal pitch.
AD9361BBCZ
AD9361BBCZ by Analog Devices is a 144-terminal RF and baseband circuit IC with a nominal voltage of 1.3V. It operates in industrial temperature range (-40 to 85°C) and features a low profile, fine pitch grid array package suitable for cellphone applications. The IC is surface mountable, with terminal finish of tin silver copper, making it ideal for compact designs.
AD6653BCPZ-105
AD6653BCPZ-105 by Analog Devices is a 64-terminal cellphone IC with a square shape and chip carrier package. Operating b/w -40 to 85 °C, it's ideal for baseband circuits in telecom applications. With a nominal voltage of 1.8V, this industrial-grade IC has a terminal pitch of 0.5mm and no lead terminal form.
MAX2051ETP+
MAX2051ETP+ by Analog Devices is a Cellphone IC with 20 terminals in a square package. It operates at -40 to 85 °C, with a supply voltage of 5V and current draw of 0.13mA. This RF and baseband circuit uses BICMOS technology for industrial telecom applications.
ST25R3911B-AQFT
RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
HMC689LP4ETR
Analog Devices' HMC689LP4ETR is a Cellphone IC with BICMOS technology, operating at -40 to 85°C. It features 24 terminals in a square chip carrier package style, suitable for RF and baseband circuits. The IC has a nominal voltage of 5V and matte tin terminal finish, making it ideal for telecom applications.
TRF4400PWR
TRF4400PWR by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
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Motorola
MC13202FCR2
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MC13201FCR2
MC13191
MC13145FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MC13191FCR2
MC13192
MC13146FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LFQFP; Package Shape: SQUARE;
MC13192FC
MC13201FC
MC13150FTB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
MC13202FC
MC13143D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MC13191FC
MC13192FCR2
MC13150FTA
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LFQFP; Package Shape: SQUARE;
MC13193
MC13751FCR2
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
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