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TRF371125IRGZR

Texas Instruments

TRF371125IRGZR by Texas Instruments

TRF371125IRGZR by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.

Median Price

$22.618

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,195 parts In-Stock

1+ parts

$21.723

100+ parts

$18.975

1k+ parts

$13.086

10k+ parts

-

14,195

$21.723

$18.975

$13.086

-

Rochester

USA . 5,686 parts In-Stock

1+ parts

-

100+ parts

$18.810

1k+ parts

$16.830

10k+ parts

$15.840

5,686

-

$18.810

$16.830

$15.840

DigiKey

USA . 5,686 parts In-Stock

1+ parts

-

100+ parts

$24.750

1k+ parts

-

10k+ parts

-

5,686

-

$24.750

-

-

Verical

USA . 3,324 parts In-Stock

1+ parts

-

100+ parts

$23.512

1k+ parts

$21.038

10k+ parts

$19.800

3,324

-

$23.512

$21.038

$19.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,521 parts In-Stock

1+ parts

$17.271

100+ parts

-

1k+ parts

-

10k+ parts

-

2,521

$17.271

-

-

-

Vyrian

USA . 1,300 parts In-Stock

1+ parts

$18.180

100+ parts

-

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-

10k+ parts

-

1,300

$18.180

-

-

-

Odintec Ltd.

Israel . 4,160 parts In-Stock

1+ parts

-

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4,160

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,011 parts In-Stock

1+ parts

$14.007

100+ parts

-

1k+ parts

$14.476

10k+ parts

-

2,011

$14.007

-

$14.476

-

DigiPath Technology Company

USA . 2,130 parts In-Stock

1+ parts

$15.423

100+ parts

-

1k+ parts

-

10k+ parts

-

2,130

$15.423

-

-

-

ChromeModa Solutions

Germany . 1,910 parts In-Stock

1+ parts

$15.738

100+ parts

$12.905

1k+ parts

-

10k+ parts

-

1,910

$15.738

$12.905

-

-

IDEA Electronic Components Group

UK . 1,656 parts In-Stock

1+ parts

$15.738

100+ parts

$14.951

1k+ parts

$14.164

10k+ parts

-

1,656

$15.738

$14.951

$14.164

-

Corphita

USA . 4,838 parts In-Stock

1+ parts

$16.362

100+ parts

-

1k+ parts

-

10k+ parts

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4,838

$16.362

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-

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A-Z Elektronik GmbH

Germany . 4,608 parts In-Stock

1+ parts

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100+ parts

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4,608

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-

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Assy Fe

Spain . 2,590 parts In-Stock

1+ parts

-

100+ parts

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2,590

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Kepictronics

USA . 1,764 parts In-Stock

1+ parts

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100+ parts

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1,764

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Overview

Discover the cutting-edge TRF371125IRGZR by Texas Instruments, designed for cellphone ICs with unmatched quality and reliability. Texas Instruments is a renowned manufacturer known for delivering top-notch products that exceed industry standards. This versatile chip carrier offers a wide range of applications in RF and baseband circuits, ensuring optimal performance. With a very thin profile and no-lead terminal form, this IC provides ease of installation and maintenance. Trust Texas Instruments to deliver innovative solutions that bring value and efficiency to your projects. Choose TRF371125IRGZR for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy is a commonly used material in electronic components due to its durability and reliability, making this product a good choice for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient and compact circuit board design, making this product suitable for sleek and modern cellphone designs.

Power Supplies (V): 5

Operating at a voltage of 5V provides a balance between power efficiency and performance, making this product ideal for mobile devices.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple high-quality finishes ensures reliable electrical connections and resistance to corrosion, enhancing the overall durability of the product.

Temperature Grade: INDUSTRIAL

Designed to withstand a wide range of temperatures from -40°C to 85°C, this product is suitable for use in various industrial environments, ensuring reliable performance under harsh conditions.

Moisture Sensitivity Level (MSL): 2

With a low moisture sensitivity level, this product is less susceptible to moisture-related damage, making it a reliable choice for applications where exposure to moisture is a concern.

Technical Specifications

Cellphone ICs TRF371125IRGZR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF371125IRGZR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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