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AD6653BCPZ-105

Analog Devices

AD6653BCPZ-105 by Analog Devices

AD6653BCPZ-105 by Analog Devices is a 64-terminal cellphone IC with a square shape and chip carrier package. Operating b/w -40 to 85 °C, it's ideal for baseband circuits in telecom applications. With a nominal voltage of 1.8V, this industrial-grade IC has a terminal pitch of 0.5mm and no lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,741 parts In-Stock

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2,741

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Digiode

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Native Components

USA . 279 parts In-Stock

1+ parts

$6.164

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279

$6.164

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AZTECH Wire

Italy . 368 parts In-Stock

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$10.625

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368

$10.625

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Parana Technologies

USA . 3,727 parts In-Stock

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$15.136

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$14.076

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3,727

$15.136

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$14.076

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IDEA Electronic Components Group

UK . 1,143 parts In-Stock

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$16.275

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$15.461

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$15.461

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1,143

$16.275

$15.461

$15.461

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DigiPath Technology Company

USA . 3,727 parts In-Stock

1+ parts

$25.389

100+ parts

$24.373

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$24.373

3,727

$25.389

$24.373

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$24.373

Ampacity Inc.

Singapore . 1,645 parts In-Stock

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$324.000

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1,645

$324.000

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Semicontronic

India . 1,283 parts In-Stock

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$607.000

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$591.825

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$588.790

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1,283

$607.000

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One Stop Electronics

USA . 1,260 parts In-Stock

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$954.000

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1,260

$954.000

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Northwest PG Solutions

USA . 887 parts In-Stock

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$6.041

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887

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$6.041

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A-Z Elektronik GmbH

Germany . 750 parts In-Stock

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750

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Corphita

USA . 56 parts In-Stock

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Overview

Enhance the performance of your cellphone with the AD6653BCPZ-105 by Analog Devices. Known for their top-notch quality and cutting-edge technology, Analog Devices delivers reliable and efficient Cellphone ICs that elevate user experience. With a surface mount design and a range of features such as a baseband circuit and nominal supply voltage of 1.8V, this product ensures seamless connectivity and optimal functionality. Trust Analog Devices to provide you with the best solutions for your cellphone needs. Experience the difference with the AD6653BCPZ-105 today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making it suitable for small electronic devices.

Package Shape: SQUARE

The square package shape helps in efficient use of space on a circuit board, maximizing component density.

No. of Terminals: 64

With a high number of terminals, this product can support complex circuit designs and connectivity requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact design for better performance in small devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in extreme cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection over time.

Terminal Position: QUAD

Quad terminal position enables efficient routing and connection of multiple signals, improving overall circuit performance.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a thin and compact design, ideal for space-constrained applications.

Width: 9 mm

With a moderate width, this product offers a balance between compactness and ease of handling during installation.

Length: 9 mm

The moderate length of the product provides a good compromise between space-saving design and component stability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in a wide range of temperature environments, making it suitable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and offers improved reliability and performance over traditional leaded components.

Telecom IC Type: BASEBAND CIRCUIT

Designed for baseband circuit applications, this product provides essential functionality for communication devices, ensuring optimal performance.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage enhances energy efficiency and extends battery life in mobile devices, reducing power consumption.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density integration of components, enabling efficient use of PCB space and improved signal integrity.

Technical Specifications

Cellphone ICs AD6653BCPZ-105 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

AD6653BCPZ-105 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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