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AD6634BBCZ

Analog Devices

AD6634BBCZ by Analog Devices

AD6634BBCZ by Analog Devices is a Cellphone IC with 196 terminals in a square grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Features CMOS technology, 2.5V supply voltage, and baseband circuit for telecom applications.

Median Price

$85.920

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 686 parts In-Stock

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Arrow

USA . 7 parts In-Stock

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$85.920

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$85.920

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$85.920

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$85.920

$85.920

Chip1Stop

Japan . 7 parts In-Stock

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Digiode

USA . 33 parts In-Stock

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$90.440

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Vyrian

USA . 5,130 parts In-Stock

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Cyclops Electronics Ltd

UK . 137 parts In-Stock

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J2 Sourcing AB

Sweden . 2 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 107 parts In-Stock

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$0.308

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-

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$0.296

107

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Northwest PG Solutions

USA . 695 parts In-Stock

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$0.339

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$0.299

695

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$0.299

Parana Technologies

USA . 2,138 parts In-Stock

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$10.132

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$9.423

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$10.132

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$9.423

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IDEA Electronic Components Group

UK . 1,998 parts In-Stock

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$10.895

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$10.350

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$10.350

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Corohmni

South Africa . 300 parts In-Stock

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$15.535

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DigiPath Technology Company

USA . 1,403 parts In-Stock

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$16.996

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$16.316

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$16.316

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$21.019

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$19.127

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$17.236

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$21.019

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Semicontronic

India . 143 parts In-Stock

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$73.030

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$71.204

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$70.839

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143

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Corphita

USA . 762 parts In-Stock

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$85.680

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RC Electronics

USA . 3,113 parts In-Stock

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A-Z Elektronik GmbH

Germany . 900 parts In-Stock

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Overview

Enhance the performance of your cellphone with the AD6634BBCZ by Analog Devices. Known for their top-quality products, Analog Devices delivers cutting-edge technology in the form of Cellphone ICs. This grid array package boasts a wide operating temperature range, ensuring reliability in various conditions. With a focus on industrial-grade technology and innovative baseband circuit design, this IC offers customers unmatched value and efficiency. Upgrade your phone's capabilities with the AD6634BBCZ and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for use in various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

No. of Terminals: 196

Having a high number of terminals enables the IC to handle complex functions and connectivity efficiently.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature conditions, ensuring reliability in different operating environments.

Technology: CMOS

CMOS technology offers low power consumption, extending battery life in mobile devices.

Nominal Supply Voltage: 2.5 V

Optimal supply voltage for efficient performance and compatibility with various power sources.

Technical Specifications

Cellphone ICs AD6634BBCZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Trade Compliance

AD6634BBCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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