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AD6672BCPZRL7-250

Analog Devices

AD6672BCPZRL7-250 by Analog Devices

Analog Devices' AD6672BCPZRL7-250 is a cellphone IC with 32 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, consumes 0.145mA, and integrates RF and baseband circuits. This surface-mount chip carrier is ideal for industrial telecom applications requiring high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 11,787 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Aztec Data Supply Inc.

USA . 243 parts In-Stock

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$7.340

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AZTECH Wire

Italy . 552 parts In-Stock

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$10.319

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Parana Technologies

USA . 524 parts In-Stock

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$10.340

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IDEA Electronic Components Group

UK . 1,361 parts In-Stock

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$11.955

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$11.357

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Corohmni

South Africa . 53 parts In-Stock

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Ampacity Inc.

Singapore . 129 parts In-Stock

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DigiPath Technology Company

USA . 1,148 parts In-Stock

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One Stop Electronics

USA . 961 parts In-Stock

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Component Stockers USA

USA . 108 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Corphita

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Overview

Enhance the performance of your cellphone with the AD6672BCPZRL7-250 by Analog Devices. Known for its top-notch quality and reliability, Analog Devices delivers cutting-edge solutions in the field of Cellphone ICs. This surface mount package offers a compact design with excellent heat dissipation capabilities, making it ideal for a wide range of applications. With a nominal supply voltage of 1.8V and low supply current, this Telecom IC Type ensures efficient operation and maximum power savings. Upgrade your device today with the AD6672BCPZRL7-250 and experience the superior technology that Analog Devices has to offer.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board, ensuring a compact design.

Power Supplies (V): 1.8

Low power supply voltage of 1.8V indicates energy efficiency and helps in reducing power consumption.

No. of Terminals: 32

Higher number of terminals allows for more connectivity options and functionalities in the device.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers a good balance of thermal management, size, and profile for optimal performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures makes the product suitable for use in various environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures long-term reliability of the terminals.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connection with the circuit board.

Maximum Seated Height: 0.8 mm

Low seated height enables a compact and slim design for the overall product.

Width: 5 mm

Compact width ensures efficient use of space on the circuit board and in the final product.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps in quick and effective soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability of the connections.

Length: 5 mm

Compact length complements the overall space-saving design of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies high reliability and suitability for industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and meets regulations for hazardous substances.

Maximum Supply Current: 0.145 mA

Low maximum supply current indicates energy efficiency and lower power consumption.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Inclusion of RF and baseband circuit types allows for versatile communication capabilities in the device.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage supports energy-efficient operation and prolongs battery life.

Terminal Pitch: 0.5 mm

Compact terminal pitch enables closer spacing of terminals for enhanced connectivity options.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, ensuring proper handling during manufacturing and storage.

Technical Specifications

Cellphone ICs AD6672BCPZRL7-250 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.145 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

AD6672BCPZRL7-250 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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