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AD6649BCPZ

Analog Devices

AD6649BCPZ by Analog Devices

AD6649BCPZ by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V. This RF and baseband circuit has a terminal pitch of 0.5mm and low supply current of 0.3mA, making it ideal for telecom applications.

Median Price

$133.430

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$64.630

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Chip1Stop

Japan . 1 parts In-Stock

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$132.000

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Rochester

USA . 1,225 parts In-Stock

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$134.860

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$126.770

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$118.680

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Analog Devices Inc

USA . 1,363 parts In-Stock

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$185.850

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$112.750

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Verical

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Digiode

USA . 250 parts In-Stock

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Vyrian

USA . 8,320 parts In-Stock

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Cyclops Electronics Ltd

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Native Components

USA . 243 parts In-Stock

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$8.597

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Parana Technologies

USA . 1,942 parts In-Stock

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$9.124

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$8.486

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$9.124

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Northwest PG Solutions

USA . 1,670 parts In-Stock

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$9.457

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$8.511

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$9.457

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IDEA Electronic Components Group

UK . 1,627 parts In-Stock

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$9.811

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$9.320

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Corohmni

South Africa . 253 parts In-Stock

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DigiPath Technology Company

USA . 2,133 parts In-Stock

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$15.305

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$14.693

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$14.693

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$15.305

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$14.693

Advanced Electronics

New Zealand . 97 parts In-Stock

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$18.596

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$16.922

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$15.249

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AZTECH Wire

Italy . 930 parts In-Stock

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$21.910

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Semicontronic

India . 167 parts In-Stock

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$21.970

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$21.421

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$21.311

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Corphita

USA . 927 parts In-Stock

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$23.265

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Component Stockers USA

USA . 1,088 parts In-Stock

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$26.260

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$139.540

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$126.180

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RC Electronics

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A-Z Elektronik GmbH

Germany . 357 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unlock the potential of your cellphone with the AD6649BCPZ by Analog Devices. Designed with precision and reliability in mind, this high-quality IC offers unparalleled performance in RF and baseband circuits. With a sleek square package shape and surface mount capability, this chip provides seamless integration into your devices. Experience the benefits of superior signal processing and enhanced connectivity, all while enjoying the peace of mind that comes with Analog Devices' reputation for excellence. Elevate your cellphone technology today with the AD6649BCPZ.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy and convenient to integrate this IC into circuit boards, saving space and allowing for automated assembly processes.

Package Shape: SQUARE

The square shape of the package provides a stable and uniform footprint, making it easier to design the layout of the circuit board and ensuring reliable performance.

Power Supplies (V): 1.8

The 1.8V power supply is commonly used in mobile devices, making this IC compatible with a wide range of cellphones and ensuring efficient power consumption.

No. of Terminals: 64

With 64 terminals, this IC offers a high level of connectivity and functionality, allowing for complex circuit designs and versatile applications in cellphone technology.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers a combination of heat dissipation, compact size, and durability, making it ideal for use in cellphones where space and thermal management are crucial.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, making this IC suitable for use in various environments and applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this IC to function in cold environments or during temperature fluctuations, ensuring consistent performance in diverse settings.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection and long-term durability of the IC.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection to the circuit board, reducing the risk of signal interference or disconnection, and ensuring a reliable performance of the IC.

Maximum Seated Height: 1 mm

The low seated height allows for a compact and slim profile, making it suitable for thin and lightweight cellphone designs without compromising on performance or functionality.

Width: 9 mm

The compact width of 9mm allows for space-efficient integration of the IC into circuit designs, making it suitable for compact cellphone models and enabling versatile placement on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and thermal management during the assembly process, reducing the risk of damage to the IC and ensuring a reliable connection.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures the IC can withstand the rigors of the soldering process, making it suitable for mass production and automated assembly techniques used in cellphone manufacturing.

Length: 9 mm

The compact length of 9mm allows for versatile placement and space-efficient integration of the IC into circuit designs, making it suitable for compact cellphone models and ensuring ease of PCB layout.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can operate reliably in harsh environmental conditions, making it suitable for rugged cellphone designs or industrial applications where temperature fluctuations are common.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and ensures compliance with environmental regulations, making this IC a sustainable and eco-friendly choice for cellphone manufacturers.

Maximum Supply Current: 0.3 mA

The low maximum supply current of 0.3mA ensures efficient power consumption, prolonging battery life and reducing energy costs for cellphones using this IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit type allows this IC to handle both wireless communication and signal processing tasks in cellphones, making it a versatile and comprehensive solution for cellphone manufacturers.

Nominal Supply Voltage: 1.8 V

The 1.8V nominal supply voltage is common in cellphone applications, ensuring compatibility and efficient power management in a wide range of cellphone models using this IC.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density integration and precise connectivity on the circuit board, enabling complex circuit designs and miniaturization of cellphone technology.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates a moderate moisture sensitivity, allowing for reasonable exposure to ambient humidity during storage and assembly without compromising the integrity and performance of the IC.

Technical Specifications

Cellphone ICs AD6649BCPZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.3 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

AD6649BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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