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ADF4360-0BCP

Analog Devices

ADF4360-0BCP by Analog Devices

ADF4360-0BCP by Analog Devices is a Cellphone IC with 24 terminals in a square package. It operates at temperatures from -40 to 85°C, suitable for industrial use. With a supply voltage of 3.3V, it is ideal for baseband circuit applications in telecommunications.

Median Price

$5.250

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,949 parts In-Stock

1+ parts

-

100+ parts

$5.250

1k+ parts

$4.700

10k+ parts

$4.420

24,949

-

$5.250

$4.700

$4.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 762 parts In-Stock

1+ parts

$5.558

100+ parts

-

1k+ parts

-

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762

$5.558

-

-

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Vyrian

USA . 811 parts In-Stock

1+ parts

$5.850

100+ parts

-

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-

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-

811

$5.850

-

-

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Avant Electronics Limited

UK . 3 parts In-Stock

1+ parts

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 24,535 parts In-Stock

1+ parts

$4.970

100+ parts

$4.846

1k+ parts

$4.821

10k+ parts

-

24,535

$4.970

$4.846

$4.821

-

Corphita

USA . 46 parts In-Stock

1+ parts

$5.265

100+ parts

-

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46

$5.265

-

-

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Parana Technologies

USA . 1,896 parts In-Stock

1+ parts

$14.046

100+ parts

-

1k+ parts

$13.063

10k+ parts

-

1,896

$14.046

-

$13.063

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

1+ parts

$15.103

100+ parts

$14.348

1k+ parts

$14.348

10k+ parts

-

1,488

$15.103

$14.348

$14.348

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DigiPath Technology Company

USA . 1,251 parts In-Stock

1+ parts

$23.561

100+ parts

$22.618

1k+ parts

-

10k+ parts

$22.618

1,251

$23.561

$22.618

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$22.618

Glotronic Ltd.

UK . 3,300 parts In-Stock

1+ parts

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3,300

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Northwest PG Solutions

USA . 747 parts In-Stock

1+ parts

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747

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Native Components

USA . 466 parts In-Stock

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466

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Overview

Enhance your cellphone's performance with the Analog Devices ADF4360-0BCP, a top-of-the-line Cellphone IC that guarantees reliability and efficiency. Manufactured by Analog Devices, a trusted name in the industry known for producing high-quality components, this IC offers unparalleled value with its advanced technology and industrial-grade temperature tolerance. Whether you're looking to improve signal processing or enhance baseband circuitry, the ADF4360-0BCP delivers outstanding results, making it a must-have for any mobile device enthusiast. Elevate your cellphone experience today with this cutting-edge component.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes it easier to integrate this IC into a circuit board, saving space and making it more convenient for assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it ideal for compact electronic devices.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V allows for compatibility with a wide range of electronic devices and power sources.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting the IC to other components, enabling more complex circuit designs.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers efficient heat dissipation and a very thin profile, making it suitable for devices where space and thermal management are crucial factors.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding thermal conditions, increasing its reliability and lifespan.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this IC to function in extreme environments without compromising performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliability during assembly, ensuring durable connections.

Terminal Position: QUAD

The quad terminal position layout enhances the IC's versatility and compatibility with various circuit board designs.

Maximum Seated Height: 1 mm

The low seated height makes this IC suitable for slim devices where space constraints are a concern.

Width: 4 mm

The compact width of 4mm ensures that the IC can be easily accommodated in tight spaces within electronic devices.

Peak Reflow Temperature °C: 240

The high peak reflow temperature tolerance simplifies the manufacturing process by allowing for reliable soldering during assembly.

Length: 4 mm

The short length of 4mm contributes to the overall compactness of the IC, making it suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures the IC's performance and reliability in harsh operating conditions typically found in industrial settings.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and provides improved signal integrity and reliability.

Telecom IC Type: BASEBAND CIRCUIT

Designed as a baseband circuit IC, it is optimized for signal processing in telecommunications applications, offering high performance in data transmission.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and minimizes power consumption.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density packaging, allowing for more terminals in a limited space, ideal for compact designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC can withstand moderate exposure to moisture during handling and assembly without affecting its performance.

Technical Specifications

Cellphone ICs ADF4360-0BCP attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADF4360-0BCP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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