Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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AT86RF233-ZU by Microchip Technology is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with power supplies of 1.8V and 3V. This RF and baseband circuit technology has a terminal pitch of 0.5mm, making it ideal for telecom applications.
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EMSNET (Excess)
Surface mount technology makes it easy to mount and solder the IC onto a printed circuit board, saving time and space in the manufacturing process.
The square package shape is versatile and allows for efficient use of space on the PCB, making it suitable for compact mobile devices.
Multiple power supply options provide flexibility in design and allow for compatibility with different voltage requirements.
Having 32 terminals allows for a higher degree of connectivity and functionality in the integrated circuit.
The various package styles offer different levels of thermal management and space-saving options, catering to different design requirements.
The high maximum operating temperature ensures reliable performance even in demanding industrial environments.
CMOS technology offers low power consumption and high speed operation, making the IC efficient and reliable for mobile applications.
Cellphone ICs AT86RF233-ZU attributes and parameters. Explore more Cellphone ICs devices from Microchip Technology
JESD-30 Code:
JESD-609 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Shape:
Package Style (Meter):
Power Supplies (V):
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Maximum Seated Height:
Sub-Category:
Nominal Supply Voltage:
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Telecom IC Type:
Temperature Grade:
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AT86RF233-ZU Telecommunications trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OHN3140U
Tt Electronics Plc
OHN3140U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 2mT. It features an output range of 25mA and operates b/w -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields in various industries.
LL4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Panjit International
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
ADRF5515ABCPZN-RL
Analog Devices
RF FRONT END CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
ADF4360-2BCP
Analog Devices' ADF4360-2BCP is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 3.3V supply, BICMOS technology, and a compact square package suitable for baseband circuits in telecom applications.
TLV320AC57CN
Texas Instruments
TLV320AC57CN by Texas Instruments is a 20-terminal IC with 3V supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a filter. Ideal for cellphone applications due to its BASEBAND CIRCUIT telecom IC type and compact IN-LINE package style.
ADL5360XCPZ-WP
ADL5360XCPZ-WP by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, ideal for RF front end circuits. This chip carrier has 36 terminals, measures 6x6 mm, and requires a nominal voltage of 3.3V for telecom applications.
AT86RF231-ZF
Microchip Technology
AT86RF231-ZF by Microchip Technology is a cellphone IC with surface mount capability. It has 1 function and comes in a square package shape. With a temperature range of -40 to 85 °C, it is suitable for industrial applications as an RF and baseband circuit.
CC1101RTKG3
CC1101RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8-3.6V. It features a square shape, nickel palladium gold finish, and industrial temperature grade suitable for RF and baseband circuits. This chip carrier has a very thin profile, measures 4x4mm in size, and can withstand peak reflow temperatures up to 260°C in surface mount applications.
TRF6901PT
TRF6901PT by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 2/3.3V and low profile flatpack package style. Ideal for RF and baseband circuits in industrial telecom applications.
TLV320AC56DW
TLV320AC56DW by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features Gull Wing terminal form, 3V supply voltage, and is ideal for baseband circuit applications in the telecom industry.
MAX2046ETJ+T
MAX2046ETJ+T by Analog Devices is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features a nominal voltage of 5V and is ideal for baseband circuit applications.
MAX5865ETM
Maxim Integrated
MAX5865ETM by Maxim Integrated is a Cellphone IC with 2 channels, 8um resolution, and 1.5V max analog input. It operates in industrial temperature range (-40 to 85°C) and supports differential input type for RF and baseband circuits in cellphones. The IC has a compact square package style with a terminal pitch of 0.5mm, making it suitable for space-constrained applications.
TCM320AC57PT
Texas Instruments TCM320AC57PT is a cellphone IC with 48 terminals in a square package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features a low profile flatpack design with gull wing terminals, ideal for baseband circuit applications.
TCM320AC57IPT
Texas Instruments TCM320AC57IPT is a 48-terminal cellphone IC with 5V power supply, operating from -40 to 85°C. Featuring A-LAW companding law, it has a flatpack package style and gull wing terminal form. Ideal for baseband circuits in telecom applications due to its low profile design and fine pitch terminals.
ADF7021-NBCPZ-RL7
Analog Devices ADF7021-NBCPZ-RL7 is a 48-terminal cellphone IC with 2.5/3.3V power supplies, operating from -40 to 85°C. It features CMOS technology, NO LEAD terminal form, and is ideal for BASEBAND CIRCUIT applications due to its compact square package style and industrial temperature grade suitability.
MAX19997AETX+
MAX19997AETX+ by Analog Devices is a Cellphone IC with BICMOS tech, 36 terminals in a square package. Operating temp range -40 to 85 °C, Telecom RF Front End Circuit for industrial use at 3.3V supply voltage.
TRF370317IRGETG4
TRF370317IRGETG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square package style suitable for industrial use.
LMV227SD/NOPB
LMV227SD/NOPB by Texas Instruments is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
MAX2606EUT+T
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
TLV320AC56CPT
TLV320AC56CPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage. It features a 13-bit linear coding, mu-law companding law, and filter for baseband circuits. This CMOS technology IC operates b/w 0-70°C and has low profile flatpack packaging suitable for telecom applications.
LMH2110TMX
LMH2110TMX by Texas Instruments is a cellphone IC with 6 terminals in a grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 4.5V, making it ideal for telecom applications.
HPA00471RUZR
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4;
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AT86RF233-ZU
Atmel
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
AT86RF233-ZUR
AT86RF233-ZUR by Microchip Technology is a cellphone IC with 32 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier has a compact square shape ideal for telecom applications.
AT86RF233-ZF
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
AT86RF233-ZFR
AT86RF212-ZU
AT86RF212-ZUR
AT86RF231-ZU
AT86RF211SAHW-R
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;
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