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AT86RF233-ZU

Microchip Technology

AT86RF233-ZU by Microchip Technology

AT86RF233-ZU by Microchip Technology is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with power supplies of 1.8V and 3V. This RF and baseband circuit technology has a terminal pitch of 0.5mm, making it ideal for telecom applications.

Median Price

$4.120

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Arrow

USA . 164 parts In-Stock

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$3.833

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$3.833

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DigiKey

USA . 1,144 parts In-Stock

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$4.120

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$3.775

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$4.120

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Mouser Electronics

USA . 693 parts In-Stock

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$4.120

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$3.870

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Verical

USA . 165 parts In-Stock

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DF Sales Co.

USA . 136 parts In-Stock

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$3.000

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DF Sales Co.

USA . 136 parts In-Stock

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Digiode

USA . 587 parts In-Stock

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$3.591

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Nova Conductors

Japan . 80 parts In-Stock

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$4.197

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80

$4.197

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Bristol Electronics

USA . 928 parts In-Stock

1+ parts

$6.608

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$2.863

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$2.709

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928

$6.608

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$2.709

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Martec Srl

Italy . 63,608 parts In-Stock

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Chip Stock

USA . 11,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,456 parts In-Stock

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VNN

France . 1,632 parts In-Stock

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Vyrian

USA . 397 parts In-Stock

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Atlantic Semiconductor

USA . 53 parts In-Stock

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ComSIT Distribution GmbH

Germany . 9 parts In-Stock

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A&K Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 688 parts In-Stock

1+ parts

$3.210

100+ parts

$3.130

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$3.114

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688

$3.210

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$3.114

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Ampacity Inc.

Singapore . 389 parts In-Stock

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$3.210

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389

$3.210

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Corphita

USA . 937 parts In-Stock

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$3.402

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937

$3.402

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Component Stockers USA

USA . 8,954 parts In-Stock

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$3.910

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$3.630

1k+ parts

$3.640

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8,954

$3.910

$3.630

$3.640

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.113

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$3.949

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500

$4.113

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$3.949

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Corohmni

South Africa . 311 parts In-Stock

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$4.190

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Argo Parts USA

USA . 1,234 parts In-Stock

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$4.197

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Continental Prestige Electronics

USA . 1,221 parts In-Stock

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$4.197

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$4.113

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$4.113

Advanced Electronics

New Zealand . 500 parts In-Stock

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$4.316

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$4.100

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$4.100

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500

$4.316

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$4.100

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Aztec Data Supply Inc.

USA . 1,845 parts In-Stock

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$6.631

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Futuretech Components

Singapore . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,428 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 7,350 parts In-Stock

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Lixinc

USA . 6,701 parts In-Stock

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Kepictronics

USA . 5,125 parts In-Stock

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Authorized Procurement Solutions

USA . 3,956 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,085 parts In-Stock

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West Coast Incorporated

USA . 2,656 parts In-Stock

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Supply Digital

USA . 1,988 parts In-Stock

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Eastek

USA . 160 parts In-Stock

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iodParts Technologies Inc.

India . 155 parts In-Stock

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$3.241

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EMSNET (Excess)

USA . 136 parts In-Stock

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136

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Overview

Experience seamless connectivity and enhanced performance with the AT86RF233-ZU by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality and reliability in cellphone ICs. This innovative product offers a wide range of applications, promising exceptional value and benefits to customers. With its advanced features and cutting-edge technology, the AT86RF233-ZU ensures optimal functionality and efficiency, making it the perfect choice for all your connectivity needs. Elevate your experience with Microchip Technology today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to mount and solder the IC onto a printed circuit board, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape is versatile and allows for efficient use of space on the PCB, making it suitable for compact mobile devices.

Power Supplies (V): 1.8, 3

Multiple power supply options provide flexibility in design and allow for compatibility with different voltage requirements.

No. of Terminals: 32

Having 32 terminals allows for a higher degree of connectivity and functionality in the integrated circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer different levels of thermal management and space-saving options, catering to different design requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the IC efficient and reliable for mobile applications.

Technical Specifications

Cellphone ICs AT86RF233-ZU attributes and parameters. Explore more Cellphone ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8,3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AT86RF233-ZU Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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