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ADF7901BRU

Analog Devices

ADF7901BRU by Analog Devices

ADF7901BRU by Analog Devices is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures from 0 to 50 °C and has a supply voltage of 3V. This RF and baseband circuit is ideal for telecom applications requiring surface mount technology.

Median Price

$3.150

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,969 parts In-Stock

1+ parts

-

100+ parts

$2.920

1k+ parts

$2.610

10k+ parts

$2.460

33,969

-

$2.920

$2.610

$2.460

DigiKey

USA . 33,969 parts In-Stock

1+ parts

-

100+ parts

$3.380

1k+ parts

$3.380

10k+ parts

$3.380

33,969

-

$3.380

$3.380

$3.380

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 465 parts In-Stock

1+ parts

$3.088

100+ parts

-

1k+ parts

-

10k+ parts

-

465

$3.088

-

-

-

Vyrian

USA . 506 parts In-Stock

1+ parts

$3.250

100+ parts

-

1k+ parts

-

10k+ parts

-

506

$3.250

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 33,584 parts In-Stock

1+ parts

$2.760

100+ parts

$2.691

1k+ parts

$2.677

10k+ parts

-

33,584

$2.760

$2.691

$2.677

-

Corphita

USA . 439 parts In-Stock

1+ parts

$2.925

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$2.925

-

-

-

Parana Technologies

USA . 1,659 parts In-Stock

1+ parts

$9.616

100+ parts

-

1k+ parts

$8.943

10k+ parts

-

1,659

$9.616

-

$8.943

-

IDEA Electronic Components Group

UK . 1,211 parts In-Stock

1+ parts

$10.340

100+ parts

-

1k+ parts

$9.823

10k+ parts

-

1,211

$10.340

-

$9.823

-

DigiPath Technology Company

USA . 316 parts In-Stock

1+ parts

$16.130

100+ parts

$15.485

1k+ parts

-

10k+ parts

$15.485

316

$16.130

$15.485

-

$15.485

Northwest PG Solutions

USA . 571 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

571

-

-

-

-

Native Components

USA . 392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

392

-

-

-

-

Overview

Enhance your cellphone's performance with the ADF7901BRU by Analog Devices. Designed for optimal connectivity and efficiency, this RF and baseband circuit offers superior quality and reliability. With a compact design and a wide range of applications, this product ensures seamless communication in any situation. Trust Analog Devices to deliver cutting-edge technology that exceeds your expectations. Upgrade your device today and experience the difference with the ADF7901BRU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and less prone to damage during usage or transportation.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, saving space and resources.

Power Supplies (V): 3

Operates at a standard voltage level of 3V, ensuring compatibility with various electronic systems and devices.

Maximum Operating Temperature: 50 °C

Can operate efficiently at higher temperatures without risking damage, providing reliability in a range of environmental conditions.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and connection options, increasing compatibility with different circuit layouts.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection, enhancing the overall performance of the product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Incorporates both RF and Baseband circuitry, offering versatile functionality for telecommunications applications.

Technical Specifications

Cellphone ICs ADF7901BRU attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

240

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ADF7901BRU Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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