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ADF7021-NBCPZ-RL7

Analog Devices

ADF7021-NBCPZ-RL7 by Analog Devices

Analog Devices ADF7021-NBCPZ-RL7 is a 48-terminal cellphone IC with 2.5/3.3V power supplies, operating from -40 to 85°C. It features CMOS technology, NO LEAD terminal form, and is ideal for BASEBAND CIRCUIT applications due to its compact square package style and industrial temperature grade suitability.

Median Price

$7.410

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 87 parts In-Stock

1+ parts

$6.820

100+ parts

$4.760

1k+ parts

$4.430

10k+ parts

-

87

$6.820

$4.760

$4.430

-

Analog Devices Inc

USA . 8,320 parts In-Stock

1+ parts

$7.170

100+ parts

$5.426

1k+ parts

$3.320

10k+ parts

$4.677

8,320

$7.170

$5.426

$3.320

$4.677

DigiKey

USA . 348 parts In-Stock

1+ parts

$7.650

100+ parts

$5.793

1k+ parts

$5.183

10k+ parts

$4.996

348

$7.650

$5.793

$5.183

$4.996

Mouser Electronics

USA . 267 parts In-Stock

1+ parts

$7.650

100+ parts

$5.800

1k+ parts

$4.860

10k+ parts

-

267

$7.650

$5.800

$4.860

-

Newark

USA . 87 parts In-Stock

1+ parts

$7.880

100+ parts

$5.970

1k+ parts

$5.290

10k+ parts

$5.140

87

$7.880

$5.970

$5.290

$5.140

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.822

10k+ parts

-

9,000

-

-

$3.822

-

Element14

Singapore . 87 parts In-Stock

1+ parts

-

100+ parts

$8.460

1k+ parts

$7.880

10k+ parts

-

87

-

$8.460

$7.880

-

Rochester

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$4.140

1k+ parts

$3.710

10k+ parts

$3.490

26

-

$4.140

$3.710

$3.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 641 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

10k+ parts

-

641

$4.076

-

-

-

Vyrian

USA . 518 parts In-Stock

1+ parts

$4.290

100+ parts

-

1k+ parts

-

10k+ parts

-

518

$4.290

-

-

-

Chip Stock

USA . 4,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,820

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 789 parts In-Stock

1+ parts

$1.688

100+ parts

-

1k+ parts

-

10k+ parts

-

789

$1.688

-

-

-

Northwest PG Solutions

USA . 2,067 parts In-Stock

1+ parts

$1.857

100+ parts

-

1k+ parts

-

10k+ parts

-

2,067

$1.857

-

-

-

Semicontronic

India . 728 parts In-Stock

1+ parts

$3.650

100+ parts

$3.559

1k+ parts

$3.540

10k+ parts

-

728

$3.650

$3.559

$3.540

-

Corphita

USA . 293 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$3.861

-

-

-

Continental Prestige Electronics

USA . 750 parts In-Stock

1+ parts

$5.670

100+ parts

$4.250

1k+ parts

$3.190

10k+ parts

-

750

$5.670

$4.250

$3.190

-

Ampacity Inc.

Singapore . 352 parts In-Stock

1+ parts

$7.940

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$7.940

-

-

-

Parana Technologies

USA . 1,190 parts In-Stock

1+ parts

$10.087

100+ parts

-

1k+ parts

$9.381

10k+ parts

-

1,190

$10.087

-

$9.381

-

IDEA Electronic Components Group

UK . 483 parts In-Stock

1+ parts

$10.846

100+ parts

$10.304

1k+ parts

$10.304

10k+ parts

-

483

$10.846

$10.304

$10.304

-

DigiPath Technology Company

USA . 727 parts In-Stock

1+ parts

$16.920

100+ parts

$16.243

1k+ parts

-

10k+ parts

$16.243

727

$16.920

$16.243

-

$16.243

QUARKTWIN TECHNOLOGY LTD

USA . 15,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,885

-

-

-

-

RC Electronics

USA . 7,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,880

-

-

-

-

Lixinc

USA . 6,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,940

-

-

-

-

Perfect Parts

USA . 441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

441

-

-

-

-

Overview

Enhance your cellphone's performance with the ADF7021-NBCPZ-RL7 by Analog Devices. Known for their top-notch quality and cutting-edge technology, Analog Devices delivers innovative solutions for cellphone ICs. This square-shaped, surface mount chip carrier offers a wide range of applications and features a very thin profile, making it ideal for various telecom needs. With a nominal supply voltage of 3V and an industrial temperature grade, this product ensures reliability and efficiency. Upgrade your device today and experience the difference with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, making this IC convenient for assembly in cellphones.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and allowing for more components to be integrated into the cellphone.

Power Supplies (V): 2.5/3.3

The dual power supply options of 2.5V and 3.3V provide flexibility in voltage requirements, ensuring compatibility with various cellphone systems.

No. of Terminals: 48

With a high number of terminals, this IC offers extensive connectivity options, enabling seamless communication within the cellphone circuitry.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles contribute to efficient heat dissipation and space-saving design in the cellphone IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments, making this IC suitable for cellphone applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in a wide range of temperature conditions, enhancing its versatility for cellphone usage.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and improves solderability, enhancing the IC's durability and reliability in cellphone manufacturing.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections on the IC, optimizing signal transmission and enhancing overall performance in cellphones.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim and compact design, facilitating the integration of the IC into the limited space of a cellphone.

Width: 7 mm

The narrow width of the IC enables it to fit within the compact form factor of a cellphone, supporting sleek and modern device designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering during manufacturing, leading to faster production of cellphones.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering processes, ensuring strong and durable connections in cellphone assembly.

Length: 7 mm

The compact length of the IC complements its square shape, contributing to a space-efficient design that is ideal for integration into cellphones.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the IC can withstand harsh operating conditions, making it a reliable choice for cellphone applications in various environments.

Technology: CMOS

The CMOS technology used in the IC provides low power consumption and high noise immunity, enhancing energy efficiency and signal integrity in cellphones.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and supports environmentally friendly manufacturing practices, ensuring eco-conscious cellphone production.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit type telecom IC, this product serves as the core component for managing communication signals within cellphones, ensuring reliable performance in voice and data transmission.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is commonly used in cellphone systems, making this IC compatible with standard power requirements for seamless integration into devices.

Terminal Pitch: 0.5 mm

The fine 0.5mm terminal pitch enables high-density packaging and efficient routing of connections, optimizing space utilization and signal transmission in the cellphone IC.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the IC requires careful handling during storage and assembly, ensuring the integrity and reliability of the product in cellphone manufacturing.

Technical Specifications

Cellphone ICs ADF7021-NBCPZ-RL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

ADF7021-NBCPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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