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MAX2608EUT+

Analog Devices

MAX2608EUT+ by Analog Devices

MAX2608EUT+ by Analog Devices is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. This baseband circuit has a nominal voltage of 2.75V and peak reflow temperature of 260°C, making it ideal for telecom applications.

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Lifecycle Status

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5

In-Stock Inventory

1k+

MAX2608EUT+ by Analog Devices
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,372 parts In-Stock

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Anansix

USA . 2,103 parts In-Stock

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2,103

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Digiode

USA . 2,079 parts In-Stock

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2,079

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ABC Electronics Ltd.

UK . 600 parts In-Stock

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600

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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MARBEL Systems

Belgium . 3,161 parts In-Stock

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$7.481

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$7.481

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Texas Native Microelectronics

USA . 58 parts In-Stock

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$8.599

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$8.255

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$7.997

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$7.567

58

$8.599

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$7.567

Kenton Components

USA . 500 parts In-Stock

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$10.319

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$9.081

500

$10.319

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$9.081

AZTECH Wire

Italy . 292 parts In-Stock

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$18.642

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Qasali Group International

UK . 504 parts In-Stock

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$23.217

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$21.592

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$20.431

504

$23.217

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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398

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One Stop Electronics

USA . 3,018 parts In-Stock

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$159.000

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Semicontronic

India . 1,358 parts In-Stock

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$725.000

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$706.875

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$703.250

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A-Z Elektronik GmbH

Germany . 7,289 parts In-Stock

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Perfect Parts

USA . 1,979 parts In-Stock

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Corphita

USA . 1,913 parts In-Stock

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Overview

Enhance the performance of your cellphone with the MAX2608EUT+ by Analog Devices. Designed with precision and quality in mind, this small outline, low profile IC delivers exceptional sound clarity and signal processing capabilities. With a nominal supply voltage of 2.75V, this industrial-grade baseband circuit is perfect for applications requiring reliable telecom ICs. Experience seamless communication and enhanced functionality with the MAX2608EUT+ - the perfect choice for your next project. Elevate your device's performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the Cellphone IC, making it a reliable choice.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on the circuit board, saving space and enabling a compact design for the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this Cellphone IC can withstand elevated temperatures without compromising performance, ensuring reliability in various operating conditions.

Nominal Supply Voltage: 2.75 V

The low nominal supply voltage of 2.75V helps in reducing power consumption, making the Cellphone IC energy-efficient and suitable for battery-operated devices.

Technical Specifications

Cellphone ICs MAX2608EUT+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

MAX2608EUT+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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