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HMC377QS16GE

Analog Devices

HMC377QS16GE by Analog Devices

Analog Devices' HMC377QS16GE is a cellphone IC with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,601 parts In-Stock

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8,601

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Digiode

USA . 701 parts In-Stock

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701

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Connector Distribution Corp

USA . 400 parts In-Stock

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400

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Right Parts Inc.

USA . 400 parts In-Stock

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400

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 600 parts In-Stock

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$5.823

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600

$5.823

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Parana Technologies

USA . 3,809 parts In-Stock

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$10.817

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$10.060

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3,809

$10.817

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$10.060

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IDEA Electronic Components Group

UK . 1,625 parts In-Stock

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$11.631

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$11.049

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$11.049

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1,625

$11.631

$11.049

$11.049

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DigiPath Technology Company

USA . 1,420 parts In-Stock

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$18.144

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$17.419

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$17.419

1,420

$18.144

$17.419

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$17.419

Semicontronic

India . 470 parts In-Stock

1+ parts

$113.000

100+ parts

$110.175

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$109.610

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470

$113.000

$110.175

$109.610

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One Stop Electronics

USA . 353 parts In-Stock

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$530.000

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353

$530.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,512 parts In-Stock

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RC Electronics

USA . 7,969 parts In-Stock

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Infinite Electronics LLP (Excess)

. 403 parts In-Stock

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403

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Corphita

USA . 163 parts In-Stock

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163

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Perfect Parts

USA . 112 parts In-Stock

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112

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Overview

Upgrade your cellphone performance with the HMC377QS16GE by Analog Devices. Known for their high-quality products, Analog Devices delivers cutting-edge technology in the field of RF and baseband circuits. This small outline, shrink pitch package offers customers a wide range of applications with its superior performance and reliability. With a temperature grade suitable for industrial use, Matte Tin terminal finish, and Dual terminal position, this product provides exceptional value and benefits to users looking to enhance their cellphone experience. Trust Analog Devices for top-notch quality and innovation in the telecom IC industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IC lightweight and durable, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability makes it easier to integrate the IC onto circuit boards, reducing production time and costs.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and functions within the IC, enhancing its performance capabilities.

Maximum Operating Temperature: 85 °C

The IC can operate at high temperatures without overheating, making it suitable for industrial applications where heat resistance is necessary.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the IC compatible with a wide range of systems, ensuring versatility and ease of integration.

Technical Specifications

Cellphone ICs HMC377QS16GE attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HMC377QS16GE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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