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CC113LRGPR

Texas Instruments

CC113LRGPR by Texas Instruments

The Texas Instruments CC113LRGPR is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it has a supply voltage of 1.8/3.6V and data rate of 0.6 Mbps. Ideal for RF and baseband circuits, this IC is surface mountable and features a moisture sensitivity level of 3.

Median Price

$1.820

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 48,176 parts In-Stock

1+ parts

$1.317

100+ parts

$1.088

1k+ parts

$0.588

10k+ parts

-

48,176

$1.317

$1.088

$0.588

-

DigiKey

USA . 5,237 parts In-Stock

1+ parts

$1.820

100+ parts

$1.361

1k+ parts

$1.188

10k+ parts

$1.052

5,237

$1.820

$1.361

$1.188

$1.052

Mouser Electronics

USA . 743 parts In-Stock

1+ parts

$2.070

100+ parts

$1.550

1k+ parts

$1.150

10k+ parts

$1.050

743

$2.070

$1.550

$1.150

$1.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,348 parts In-Stock

1+ parts

$0.752

100+ parts

-

1k+ parts

-

10k+ parts

-

3,348

$0.752

-

-

-

Digiode

USA . 4,749 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

-

10k+ parts

-

4,749

$1.251

-

-

-

Component Sense

UK . 1,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,761

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,608 parts In-Stock

1+ parts

$1.185

100+ parts

-

1k+ parts

-

10k+ parts

-

4,608

$1.185

-

-

-

Parana Technologies

USA . 1,271 parts In-Stock

1+ parts

$10.488

100+ parts

-

1k+ parts

$10.999

10k+ parts

-

1,271

$10.488

-

$10.999

-

DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$11.548

100+ parts

$10.624

1k+ parts

-

10k+ parts

-

694

$11.548

$10.624

-

-

ChromeModa Solutions

Germany . 6,142 parts In-Stock

1+ parts

$11.784

100+ parts

$9.663

1k+ parts

-

10k+ parts

-

6,142

$11.784

$9.663

-

-

IDEA Electronic Components Group

UK . 504 parts In-Stock

1+ parts

$11.784

100+ parts

$11.195

1k+ parts

$10.606

10k+ parts

-

504

$11.784

$11.195

$10.606

-

Lixinc

USA . 13,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,632

-

-

-

-

A-Z Elektronik GmbH

Germany . 12,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,284

-

-

-

-

Epart123

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.750

10k+ parts

$0.750

12,000

-

-

$0.750

$0.750

Alle Elektronik GmbH

Germany . 4,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,856

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Native Components

USA . 603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

603

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Northwest PG Solutions

USA . 476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

476

-

-

-

-

S.R.D Solutions

India . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Overview

Experience top-tier quality and reliability with the Texas Instruments CC113LRGPR, a cutting-edge Cellphone IC that promises unmatched performance. Crafted by one of the most trusted names in the industry, this IC offers seamless integration and exceptional functionality for a wide range of applications. From enhancing communication systems to optimizing data transmission, this product delivers unparalleled value and benefits to customers seeking superior performance and efficiency. Elevate your projects with the CC113LRGPR and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and reliability for the product, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 1.8/3.6

Offers flexibility in power requirements, making it suitable for various applications and power sources.

No. of Terminals: 20

Sufficient number of terminals for connecting various components and peripherals in the system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides efficient heat dissipation and compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, improving reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides corrosion resistance and high conductivity for efficient signal transmission.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Specifically designed for telecommunications applications, ensuring optimized performance in cellphones.

Moisture Sensitivity Level (MSL): 3

Suitable for environments with moderate levels of moisture, ensuring reliability in various conditions.

Technical Specifications

Cellphone ICs CC113LRGPR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Data Rate:

.6 Mbps

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

CC113LRGPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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