Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MAX5865ETM by Maxim Integrated is a Cellphone IC with 2 channels, 8um resolution, and 1.5V max analog input. It operates in industrial temperature range (-40 to 85°C) and supports differential input type for RF and baseband circuits in cellphones. The IC has a compact square package style with a terminal pitch of 0.5mm, making it suitable for space-constrained applications.
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Allows for easy and efficient integration into circuit boards, saving space and reducing assembly time.
Provides accurate and reliable output data representation for processing and communication purposes.
Square package shape ensures uniformity and simplicity in design layout, making it convenient for placement and routing.
Supports a range of power supply options for flexibility in different operating environments.
Sufficient number of terminals for connectivity and functionality requirements in cellphone applications.
Offers various package styles for compatibility with different assembly processes and space constraints.
High maximum operating temperature ensures reliable performance in harsh conditions or extended usage.
Wide temperature range allows for operation in both hot and cold environments.
Tin lead finish provides good solderability and conductivity, enhancing the reliability of electrical connections.
Sufficient maximum output voltage for supporting various signal processing requirements in cellphones.
Quad terminal position facilitates easy connectivity and layout planning for efficient circuit design.
Voltage output specification provides critical information for interfacing and compatibility with other components.
Low maximum seated height allows for compact and slim cellphone designs.
Optimal width measurement for integration into standard cellphone form factors.
Suitable maximum analog input range for processing analog signals in cellphone applications.
High peak reflow temperature tolerance ensures component reliability during assembly processes.
Standard length measurement for compatibility with typical cellphone design layouts.
Industrial temperature grade ensures consistent performance in challenging operating conditions.
Dual-channel configuration allows for simultaneous processing of multiple signals or data streams.
CMOS technology offers low power consumption and high noise immunity, ideal for mobile devices like cellphones.
No-lead terminal form simplifies assembly and rework processes while reducing environmental impact.
Combination of RF and baseband circuit functionality in a single IC for enhanced communication capabilities in cellphones.
Standard nominal supply voltage suitable for powering various components in cellphone systems.
Fine terminal pitch allows for high-density mounting and efficient use of PCB space in cellphone designs.
Fine resolution specification for accurate data processing and representation in cellphone applications.
Differential input type enhances signal integrity and noise immunity for reliable performance in cellphone circuits.
Cellphone ICs MAX5865ETM attributes and parameters. Explore more Cellphone ICs devices from Maxim Integrated
Maximum Analog Input:
Input Type:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Channels:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output (V):
Output Code:
Maximum Output Voltage:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Resolution (um):
Maximum Seated Height:
Sub-Category:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
MAX5865ETM Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
President & CEO
Tunc Doluca
Senior VP & CFO
Brian C. White
Senior VP, Technology & Manufacturing Group
Vivek Jain
Fabrication
Fab Initiation
Philippines
Cavite
Wafer Capacity
489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
EU2B-YS2J03C
Idec
ROTARY SWITCH;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
SMBJ18CA
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Jiangsu Jiejie Microelectronics
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
Fagor Electronica S Coop
Transys Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Diotec Electronics
Itt Semiconductor
RFFM6903TR7
Rf Micro Devices
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 28; Package Code: HLGA; Package Shape: SQUARE;
MAX2059ETL+T
Analog Devices
MAX2059ETL+T by Analog Devices is a 40-terminal cellphone IC with BICMOS tech. Operating temp range -40 to 85 °C, peak reflow temp 260°C. Used in RF and baseband circuits for telecom applications due to its compact square chip carrier package.
F2480NBGI
Integrated Device Technology
RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
HMC601LP4E
Analog Devices' HMC601LP4E is a 24-terminal cellphone IC in a square chip carrier package. With an operating temperature range of -40 to 85°C, it's ideal for industrial telecom applications requiring RF front end circuits. The IC operates at a nominal voltage of 3.3V and features matte tin over nickel terminal finish.
AD6634XBC
AD6634XBC by Analog Devices is a Cellphone IC with 196 terminals in a square GRID ARRAY package. Operating temp range -40 to 70 °C, CMOS tech, and 2.5V supply voltage make it ideal for BASEBAND CIRCUIT applications.
CC110LRTKR
CC110LRTKR by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V and terminal finish of NiPdAu. Ideal for RF and baseband circuits, it has a compact size of 4x4mm and is suitable for industrial temperature grades.
LMV227SD/NOPB
LMV227SD/NOPB by Texas Instruments is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
LMV228SDX/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
LMH2120UMX
LMH2120UMX by Texas Instruments is a Cellphone IC with RF and baseband circuit. It features 6 terminals in a rectangular grid array package style, suitable for telecom applications. Operating temperature ranges from -40 to 85°C, making it ideal for industrial use.
CC1100RTKG3
CC1100RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 1.8/3.6V, CMOS technology, and RF/baseband circuitry for telecom applications. This surface-mount chip carrier has a square shape and very thin profile, making it suitable for industrial use in compact devices.
TLV321AC36IDW
TLV321AC36IDW by Texas Instruments is a Cellphone IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features CMOS technology, Gull Wing terminal form, and is ideal for baseband circuit applications.
ADF4360-0BCPRL7
Analog Devices' ADF4360-0BCPRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C, suitable for industrial telecom applications requiring a compact square chip carrier package with a low profile design.
CC1151TRHBRG4Q1
CC1151TRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, data rate of 0.25 Mbps, and RF/baseband circuit for telecom applications. This chip carrier has a very thin profile, nickel palladium gold finish, and AEC-Q100 screening level.
SI4711-B30-GM
Silicon Labs
SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.
LMH6523SQ/NOPB
LMH6523SQ/NOPB by Texas Instruments is a 54-terminal cellphone IC with a rectangular package style. It operates in industrial temperature range (-40 to 85°C) and has 4 channels for RF and baseband circuits. With a max gain tolerance of 25.74 dB, it consumes up to 485 mA at nominal voltage of 5V, making it suitable for telecom applications.
CC1000PWR
CC1000PWR by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry, and CMOS technology. This small outline package is ideal for telecom applications requiring low power consumption and high reliability in industrial environments.
HMC830LP6GETR
Analog Devices' HMC830LP6GETR is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, nominal voltage of 3.3V, and terminal pitch of 0.5mm for telecom applications.
AFE7921IABJ
AFE7921IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a compact size of 17x17 mm and is surface mountable.
MAMF-011139-TR1000
M/a-com Technology Solutions
RF FRONT END CIRCUIT;
SI4721-B20-GMR
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MAX5865ETM-T
Maxim Integrated
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MAX5865ETM+T
MAX5865ETM+
MAX5865E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;
MAX5864E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N;
MAX5866ETM+
MAX5866ETM+T
MAX5863E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS;
MAX5864ETM+
MAX5863ETM+T
MAX5864ETM+T
MAX5863ETM
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES;
MAX5864ETM
MAX5863ETM-T
Supply Digital Components
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